DE35-ST Operating Instructions
D292469I 75
5. The new value for Pick Up Delay is retained in long term memory and will not
have to be re-entered when the machine is next turned ON.
6. The delay may be changed at any time using the procedure outlined above.
Adjusting Lift to Search Height
LIFT TO SEARCH HEIGHT AT XXXX u/se enables a slow lift off the Gel-pak or tape to a
predetermined search height. This is to assist in peeling the adhesive off the back of the
die and without jerking the die off the Pickup Tip.
1. Place the system in Single Step Mode by pressing the SINGLE STEP key.
2. Cycle the system until the LCD displays LIFT TO SEARCH HEIGHT AT
XXXX u/sec.
3. The + / - key will increase or decrease the speed the Pickup Tip will lift
to a predetermined search height. The COARSE/FINE key will toggle
between 100 and 1,000 U/sec increments. The range is between 100
and 8,000 u/sec.
4. When the Foot Pedal is pressed again the lift to search height will occur
and the LCD will display GO UP TO TRAVERSE HEIGHT.
5. At this step the UP and DOWN keys will adjust the search height. For no delay in
picking, make the search height the same as the pick height.
Adjusting Pickup Tip Height at Placement
Place the system in Single Step Mode by pressing the SINGLE STEP key. Cycle the system
until the pickup is at the down position over the waffle pack. In this position, pressing
the UP or DOWN keys will adjust the placement height.
When a die is removed from tape, a tiny static charge is generated. Depending on die
structure and pickup tip material, this charge may not leak away into the pick up tip. For
die sizes smaller than 0.050 in., the backside charge can cause unreliable die placement
and should be grounded onto the conductive waffle pack.
To ensure this, the placement height should be adjusted so that the die is placed into
contact with the bottom of the waffle pack cavity. When in contact, the message
PICKUP IN CONTACT will show in the display.
Usually backside static charge is only an inconvenience with die sizes under about 0.050
in. With die sizes larger than this, placement height is not critical.
If necessary, use the COARSE/FINE key to toggle adjustment between 0.00125 inch/step
and 0.0125 inch/step, COARSE or FINE will appear in the top line of the display on the
right.
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