78 D292469I
NOTE: Any contamination on the pickup surface (such as finger grease), or on
the wafer (such as photo-resist material) will impair die release reliability.
There is a trade-off between Purge Time and Purge Pressure. You will need a shorter
time using a higher pressure. When using high blow off pressure, it is important to
adjust the placement height so that the die is not blown out of the cavity. See
ADJUSTING THE PLACEMENT HEIGHT section above.
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