64 D292469I
5. LIFT NEEDLES
Eject Head Needles are raised. No software adjustment necessary,
however, the needle height may need adjustment. This is a mechanical
adjustment: to raise the needles turn the Stop Ring on the Eject Actuator
counter clockwise, to lower turn the Stop Ring clockwise.
Note: Pneumatic Ejectors only, see Motorized Ejector section on page 105 for
details.
6. WAIT N.NNN SECS FOR DIE TO LIFT.
Displayed time will be the amount of time the Pickup Arm waits in the
current position for the die to be released from the tape. Generally, the
default time of 0.030sec is correct, but larger die may need a longer
amount of time to peel from the tape. This time is adjustable using the
+/ - keys with the Coarse/Fine keys. Run the machine in normal RUN
Mode for a few cycles to determine how long the wait time should be.
7. LIFT TO SEARCH HEIGHT AT 8000 u/sec.
When this is displayed on the LCD you can adjust the speed at which the
pickup head will lift to search height. The range is 100 to 8000 u/sec.
Coarse will adjust in increments of 1000 and Fine will adjust in
increments of 100.
8. GO UP TO TRAVERSE HEIGHT.
The Pickup Head will rise to Traverse Height to clear obstructions when
moving.
If a delayed pick is desired to allow the Gel-pak to peel off the die, set a
search height that is above the Pick Height and below the Traverse
Height. The Pickup Head will travel to this height at the speed set in the
previous step. If no delay is desired, leave the Search Height the same as
the Pick Height.
9. TURN OFF TAPE VACUUM.
The vacuum to the Eject Head is turned OFF.
10. RETRACT NEEDLES.
The air to the Actuator is turned OFF and the needles are retracted. This
allows the wafer to be moved to the next die to be picked.
11. TABLE GO TO PLACE POSITION.
The table will move to the proper position to place the next die. If
inspection options are installed on the system, this step will occur after
the inspections are completed.
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