Xilinx Spartan-6 FPGA Series User Manual

Spartan-6 FPGA PCB Design and Pin Planning www.xilinx.com 71
UG393 (v1.1) April 29, 2010
Recommended PCB Design Rules for BGA and CSP Packages
Tabl e A - 2: Recommended PCB Design Rules (mm) for BGA Packages
Design Rule FT(G)256
FG(G)484
FG(G)676
FG(G)900
Component land pad diameter (SMD)
(1)
0.40 0.45
Solder land (L) diameter 0.40 0.40
Opening in solder mask (M) diameter 0.50 0.50
Solder (ball) land pitch (e) 1.00 1.00
Line width between via and land (w) 0.13 0.13
Distance between via and land (D) 0.70 0.70
Via land (VL) diameter 0.61 0.61
Through hole (VH) diameter 0.300 0.300
Notes:
1. Component land pad diameter refers to the pad opening on the component side (solder mask defined).
The space between the NSMD pad and the solder mask, as well as the actual signal trace widths,
depend on the capability of the PCB vendor. PCB costs increase as the line width and spaces become
smaller.
Tabl e A - 3: Recommended PCB Design Rules (mm) for CSP Packages
Design Rule
CSG225
CSG324
CSG484
CPG196
Component land pad diameter (SMD)
(1)
0.40 0.30
Solder land (L) diameter 0.37 0.27
Opening in solder mask (M) diameter 0.47 0.35
Solder (ball) land pitch (e) 0.80 0.50
Line width between via and land (w) 0.13 0.13
Distance between via and land (D) 0.56 0.35
Via land (VL) diameter 0.51 0.27
Through hole (VH) diameter 0.25 0.15
Notes:
1. Component land pad diameter refers to the pad opening on the component side (solder mask defined).

Xilinx Spartan-6 FPGA Series Specifications

General

Device Family	Spartan-6
Category	FPGA
Number of Logic Cells	3, 840 to 147, 443
Block RAM	216 Kb to 4, 824 Kb
Maximum User I/O	102 to 576
Process Technology	45nm
Operating Voltage	1.2V
Number of DSP Slices	8 to 180
Package Options	FG256, FG484, FG676, FG900, FG1156, FT256, FTG256, FTG484, FTG676, FTG900, FTG1156