AMD Vega 10 User Manual

7.3.2 FCBGA Reference Reflow Profile for RoHS/Lead-free Solder
Figure 7–4 FCBGA Reference Reflow Profile for RoHS/Lead-Free SMT
Notes when using RoHS/lead-free solder (SAC305 Tin-Silver-Cu):
• The final reflow temperature profile will depend on the type of solder paste and
chemistry of flux used in the SMT process or BGA rework process. Modifications
to this reference reflow profile may also be required in order to accommodate
to other critical components.
• The use of a reflow oven with 10 heating zones or above is highly recommended.
• To ensure that the reflow profile meets the target specification on both sides of
SMT components, a different reflow profile for the first and second reflow may
be required.
• A mechanical stiffening carrier boat can be used to minimize PWB warpage
during the reflow process.
• It is suggested to decrease the temperature cooling rate to minimize BGA
component and PWB warpage.
• This recommended reflow profile applies only to the RoHS/lead-free (high
temperature) soldering process, and it should not be applied to Eutectic solder
packages without any reliability validation.
• Maximum three reflows are allowed on the same part.
74 Mechanical Data
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AMD Vega 10 Specifications

General

Process Size	14 nm
Transistor Count	12.5 billion
Memory Type	HBM2
GPU	Vega 10
Stream Processors	4096
Texture Units	256
ROPs	64
Memory Size	8 GB
Die Size	486 mm²
Memory Bandwidth	483.8 GB/s
Compute Units	64
FP32 (float) Performance	12.66 TFLOPS
Memory Bus	2048-bit