AMD Vega 10 User Manual

6
Thermal Data
To link to a topic of interest, use the following list of linked cross-references:
• Thermal Models (p. 65)
• Thermal Characteristics (p. 65)
• Thermal Design Power (p. 66)
• Thermal Diode Characteristics (p. 66)
• Storage Requirements (p. 67)
6.1 Thermal Models
For simplified thermal simulations, the Delphi model can be utilized. The compact
thermal model of the ASIC is provided in the following table.
Table 6–1 ASIC Compact Thermal Model
Variable Value
θ
JC
: Junction to case thermal resistance (based on the two-resistor model).
Note: Case here means the center of the top of the GPU package.
0.02℃/W
θ
JB
: Junction to board thermal resistance (based on the two-resistor model). 2.81℃/W
6.2 Thermal Characteristics
Table 6–2 Thermal Characteristics
Variable Value
T
j,op
: Maximum recommended operating temperature.
This is the maximum temperature at which the functionality is qualified and
tested. Operation above this temperature will negatively impact product
reliability.
This temperature is measured using an on-die temperature sensor near the
integrated thermal diode (see Thermal Diode Characteristics (p. 66)).
85℃ (air cooled)
70℃ (liquid cooled)
T
j,max
: Absolute maximum rated junction temperature.
This is the maximum allowable instantaneous GPU temperature, above
which damage to the GPU is likely.
This temperature is measured using an on-die temperature sensor near the
integrated thermal diode (see Thermal Diode Characteristics (p. 66)).
91℃ (air cooled)
76℃ (liquid cooled)
Minimum ambient operating temperature.
0℃
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"Vega 10" Databook
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AMD Vega 10 Specifications

General

Process Size	14 nm
Transistor Count	12.5 billion
Memory Type	HBM2
GPU	Vega 10
Stream Processors	4096
Texture Units	256
ROPs	64
Memory Size	8 GB
Die Size	486 mm²
Memory Bandwidth	483.8 GB/s
Compute Units	64
FP32 (float) Performance	12.66 TFLOPS
Memory Bus	2048-bit