2.11.5 Power Consumption
Please note that the power consumption of any SoC device strongly depends on the application (on the
configured bitstream and I/O activity).
To estimate the power consumption of your design, please use the Xilinx Power Estimator available on the
Xilinx website.
2.11.6 Heat Dissipation
High performance devices like the Xilinx Zynq-7000 SoC need cooling in most applications; always make
sure the SoC is adequately cooled.
Table 17 lists the heat sink and thermal pad part numbers that are compatible with the Mercury ZX1 SoC
module. Details on these parts and additional information that may assist in selecting a suitable heat sink
for the Mercury ZX1 SoC module can be found in the Enclustra Modules Heat Sink Application Note [17].
Product Name Package Name Heat Sink Part Number Thermal Pad Part Number
Mercury ZX1 FBG676,FFG676 [24] ATS-52270G-C1-R0 TG6050-28-28-1
Table 17: Heat Sink Type
Please note that the provided parts are recommended for prototyping purposes. In cases where the module
in used in environments subject to vibrations, a heat sink with a clip may be required for optimal fixation.
Warning!
Depending on the user application, the Mercury ZX1 SoC module may consume more power than can
be dissipated without additional cooling measures; always make sure the SoC is adequately cooled by
installing a heat sink and/or providing air flow.
2.11.7 Voltage Monitoring
Several pins on the module connector on the Mercury ZX1 SoC module are marked as VMON. These are
voltage monitoring outputs that may be used to measure some of the on-board voltages. Examples of such
monitoring circuits are available on Enclustra base boards.
It is not allowed to draw power from the voltage monitoring outputs.
Table 18 presents the VMON pins on the Mercury ZX1 SoC module.
D-0000-403-002 27 / 56 Version 05, 25.07.2019
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