Module SDRAM Type Density Configuration Manufacturer
ME-ZX1-D10 (commercial) NT5CC256M16CP-DI 4 Gbit 256 M × 16 bit Nanya
ME-ZX1-D10 (industrial) NT5CC256M16CP-DII 4 Gbit 256 M × 16 bit Nanya
ME-ZX1-D10 (industrial) NT5CC256M16ER-EKI 4 Gbit 256 M × 16 bit Nanya
ME-ZX1-D10 (industrial) K4B4G1646D-BMK0 4 Gbit 256 M × 16 bit Samsung
ME-ZX1-D10 (industrial) K4B4G1646E-BMMA 4 Gbit 256 M × 16 bit Samsung
ME-ZX1-D10 (industrial) H5TC4G63CFR-RDI 4 Gbit 256 M × 16 bit SK Hynix
Table 24: DDR3 SDRAM (PL) Types
Warning!
Other DDR3 memory devices may be equipped in future revisions of the Mercury ZX1 SoC module.
Please check the user manual regularly for updates. Any parts with different speed bins or temperature
ranges that fulfill the requirements for the module variant may be used.
Please note that although 4 Gbit memories are used, only 2 Gbits (256 MB) are available, because the most
significant address bit is not mapped to the FPGA pins (due to the limited number of FPGA I/Os).
2.16.2 Signal Description
Please refer to the Mercury ZX1 SoC Module FPGA Pinout Excel Sheet [4] for detailed information on the
DDR3 SDRAM connections.
2.16.3 Termination
Warning!
No external termination is implemented on the Mercury ZX1 SoC module. Therefore, it is strongly
recommended to enable the on-die termination (ODT) feature of the DDR3 SDRAM device.
2.16.4 Parameters
Please refer to the Mercury ZX1 SoC module reference design [2] for DDR3 settings guidelines. The DDR3
SDRAM parameters to be set in Vivado project are presented in Table 25.
The values given in Table 25 are for reference only. Depending on the equipped memory device on the
Mercury ZX1 SoC module and on the DDR3 SDRAM frequency, the configuration may be different to the
one in the reference design. Please refer to the memory device datasheet for details.
D-0000-403-002 32 / 56 Version 05, 25.07.2019
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