4 Mx-Series Operation Manual
The X-Y gantry was developed with precision control technology,
precision equipment design and analysis to ensure high
productivity. The placing accuracy of the system is maximized
through closed-loop control and calibration system.
2. High speed compact head (Mx100) of 0.22 sec/chip
Precision head (Mx100P) of 0.39 sec/IC
For high-speed and exact placing, Mx100 uses a 4-module head,
and Mx100P uses 2 precision heads at the same time.
High speed head of 0.16 sec/chip (Mx200)
Precision head of 0.21 sec/IC (Mx200P)
Precision head of 0.30 sec/IC (Mx200TP)
For high-speed and exact placing, Mx200 uses a 6-module head,
and Mx200P uses 4 module heads and one precision head at the
same time.
Mx200TP uses 3 precision heads at the same time.
High speed head of 0.078 sec/chip (Mx400)
Module + precision head of 0.09 sec/IC (Mx400P)
High speed head of 0.09 sec/chip (Mx400S)
Module + precision head of 0.11 sec/IC (Mx400PS)
Mx400 uses 2 Gantries, Dual Conveyor and 6-module + 6-module
heads.
Mx400P uses 2 Gantries, Dual Conveyor and 6-module + 3
precision heads.
Mx400S employs an auto width-adjusting single conveyor for
Mx400.
Mx400PS employs an auto width-adjusting single conveyor for
Mx400P.
3. Mx-Series features various combinations of XY gantries and
heads to construct an optimized system environment and implement
differentiated performance and quality to provide various options to
meet user needs.
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