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Mirae Mx200 - Positioning Head

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Chapter 4 Mx-Series Unit Description 4-
19
X-Y Resolution
0.001mm (0.0000394”)
* Figures inside parenthesis indicate rounded values.
Positioning Head
Types
The head picks up or places components using the nozzle attached at the
end of the header.
Head types include modular and precision heads.
Functions
Modular Head: Suitable for high-speed placement of chip type
components and small leaded components. For instance, a 6-spindle
modular head can pick up or place 6 components at the same time.
Precision Head: Suitable for components requiring precision jobs such as
fine-pitch components and large leaded components.
Placement System
One 6-spindle modular head is installed on the X gantry (or X-Frame) and
no precision head is used.
The modular head is suitable for high-speed placement of chip type
components and small leaded components.
Structure, features and specification of modular head are described below.
Structure and Features

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