Nokia NSW-5 Series - Page 70

NSW-5
System Module UT5U
PAMS Technical Documentation
Page 56
Issue 1 10/00
 Nokia Mobile Phones Ltd.
C923 2320941 Ceramic cap. 10 V 0402
C924 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C925 2320524 Ceramic cap. 3.3 p 0.25 % 50 V 0402
C927 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C928 2320524 Ceramic cap. 3.3 p 0.25 % 50 V 0402
C931 2320522 Ceramic cap. 2.7 p 0.25 % 50 V 0402
C932 2320501 Ceramic cap. 50 V 0402
C934 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C937 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C938 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C939 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C941 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C943 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C949 2320522 Ceramic cap. 2.7 p 0.25 % 50 V 0402
C954 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C955 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C961 2320536 Ceramic cap. 10 p 5 % 50 V 0402
C962 2320552 Ceramic cap. 47 p 5 % 50 V 0402
C963 2320778 Ceramic cap. 10 n 10 % 16 V 0402
C965 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C966 2320744 Ceramic cap. 1.0 n 10 % 50 V 0402
C968 2320921 Ceramic cap. 3.9 p 5 % 16 V 0402
C969 2320552 Ceramic cap. 47 p 5 % 50 V 0402
C970 2320530 Ceramic cap. 5.6 p 0.25 % 50 V 0402
C972 2320131 Ceramic cap. 33 n 10 % 16 V 0603
C981 2320530 Ceramic cap. 5.6 p 0.25 % 50 V 0402
C982 2320560 Ceramic cap. 100 p 5 % 50 V 0402
C984 2320540 Ceramic cap. 15 p 5 % 50 V 0402
C992 2320546 Ceramic cap. 27 p 5 % 50 V 0402
C999 2320903 Ceramic cap. 2.7 p 5 % 16 V 0402
L150 3203735 Ferrite bead 30r/100mhz 0805 0805
L701 3643007 Chip coil 18 n 5 % Q=30/250 MHz
0805
L702 3645063 Chip coil 270 n 5 % Q=48/250 MHz
0805
L703 3640045 Chip coil 10.Q n 5 % Q=55/750 MHz
0805
L705 3641622 Chip coil 220 n 5 % Q=30/100 MHz
0805
L721 3641521 Chip coil 6. Q n 5 % Q=50/250 MHz
0805
L723 3645147 Chip coil 100 n 5 % Q=12/100 MHz
0603
L724 3608407 Chip coil 470 n 5 % 1206
L740 3645231 Chip coil 39.Q n 5 % Q=40/250 MHz
0603
L741 3641620 Chip coil 180 n 5 % Q=35/100 MHz
0805