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NXP Semiconductors MPC5777M - Page 143

NXP Semiconductors MPC5777M
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Document revision history
MPC5777M Microcontroller Data Sheet, Rev. 6
NXP Semiconductors 143
2 4/2013
Electrical characteristics—Oscillator and FMPLL (con’t)
Table 23 (External Oscillator electrical specifications):
New specification: V
HYS
(Comparator Hysteresis)
New specification: V
EXTAL
(Oscillation Amplitude on the EXTAL pin after startup)
Specification change: f
XTAL
range values changed: f
XTAL
ranges are 4–8 MHz,
>8–20 MHz, and >20–40 MHz (previously stated as 4–8 MHz, 8–16 MHz, and
20–40 MHz
Specification change t
cst
(Crystal start-up time) is now specified by temperature range
Specification change: V
IHEXT
specified at V
REF
=0.28 * V
DD_HV_IO_JTAG
(previously
specified at V
DDOSC
= 3.0 V and V
DDOSC
=5.5V)
Specification change: V
ILEXT
specified at V
REF
= 0.28 * V
DD_HV_IO_JTAG
(previously
specified at V
DDOSC
= 3.0 V and V
DDOSC
=5.5V)
Specification change: C
S_EXTAL
values specified by package (was previously based on
selected load capacitance value)
Specification change: C
S_XTAL
values specified by package (was previously based on
selected load capacitance value)
Specification change: g
m
(Oscillator Transconductance) is now specified by
temperature and frequency range conditions (was previously specified without
conditions)
Footnote added: “All oscillator specifications are valid for
V
DD_HV_IO_JTAG
= 3.0 V 5.5 V.“
Footnote added to C
S_EXTAL
, C
S_XTAL
to refer to crystal manufacturer's specifications
for load capacitance values.
Footnote added: “Amplitude on the EXTAL pin after startup is determined by the ALC
block, i.e., the Automatic Level Control Circuit. The function of the ALC is to provide
high drive current during oscillator startup, but reduce current after oscillation in order
to reduce power, distortion, and RFI, and to avoid over-driving the crystal. The
operating point of the ALC is dependent on the crystal value and loading conditions.”
Footnote added: “I
XTAL is the oscillator bias current out of the XTAL pin with both
EXTAL and XTAL pins grounded. This is the maximum current during startup of the
oscillator. The current after oscillation is typically in the 2–3 mA range and is dependent
on the load and series resistance of the crystal.”
•V
ILEXT parameter, changed “External Reference” to “External Clock Input”
•VILEXT parameter, added footnote: This parameter is guaranteed by design rather than
100% tested.
Table 24 (Selectable load capacitance):
Changed footnote 2 from “Values in this table do not include 8 pF routing and ESD
structure on die and package trace capacitance.” to "Values in this table do not include
the die and package capacitances given by Cs_xtal/Cs_extal in Table 23 (External
Oscillator electrical specifications).”
Electrical characteristics—ADC specifications
Section 3.10.1, ADC input description
Table 26 (ADC pin specification)
•I
LK
_
IN
specification change: removed T
A
= 125 °C row from (T
A
= 125 °C)
•I
LK_INUD
, I
LK_INUSD
, I
LK_INREF
, and I
LK_INOUT
specification changes to parameters,
conditions, and values.
Specification change: I
INJ
min value is –3 mA (was –1)
Specification change: C
S
max value is 8.5 pF (was 7)
Specification change: R
SWn
max value for SARn channels is 1.1 k (was 0.6)
Table 76. Revision history (continued)
Revision Date Description of changes

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