NXP Semiconductors MPC5777M - DC electrical specifications

MPC5777M Microcontroller Data Sheet, Rev. 6
Electrical characteristics
NXP Semiconductors26
3.5 DC electrical specifications
The following table describes the DC electrical specifications.
38
The I/O pins on the device are clamped to the I/O supply rails for ESD protection. When the voltage of the input pin is above
the supply rail, current is injected through the clamp diode to the supply rail. For external RC network calculation, assume
typical 0.3 V drop across the active diode. The diode voltage drop varies with temperature.
39
Sum of all controller pins (including both digital and analog) must not exceed 200 mA. A V
DD_HV_IO
power segment is defined
as one or more GPIO pins located between two V
DD_HV_IO
supply pins.
Table 9. Emulation (buddy) device operating conditions
1
1
The ranges in this table are design targets and actual data may vary in the given range.
Symbol Parameter Conditions
Value
Unit
Min Typ Max
Frequency
— SR Standard JTAG 1149.1/1149.7 frequency — — — 50 MHz
— SR High-speed debug frequency — — — 320 MHz
— SR Data trace frequency — — — 1250 MHz
Temperature
T
J_BD
SR Device junction operating temperature
range
— –40.0 — 150.0 °C
T
A _BD
SR Ambient operating temperature range — –40.0 — 125.0 °C
Voltage
V
DD_LV_BD
SR Buddy core supply voltage — 1.2 — 1.365 V
V
DD_HV_IO_BD
SR Buddy I/O supply voltage — 3.0 — 5.5 V
V
RAMP_LV_BD
SR Buddy slew rate on core power supply pins — — — 100 V/ms
V
RAMP_HV_BD
SR Buddy slew rate on HV power supply pins — — — 100 V/ms
Table 10. DC electrical specifications
1
Symbol Parameter Conditions
Value
Unit
Min Typ Max
I
DD_LV
CC Maximum operating
current on the V
DD_LV
supply
2
T
J
= 150
o
C
V
DD_LV
= 1.325 V
f
MAX
——1140mA
I
DDAPP_LV
CC Application use case
operating current on the
V
DD_LV
supply
3
T
J
= 150 °C
V
DD_LV
= 1.325 V
f
MAX
——950mA
I
DD_LV_PE
CC Operating current on
the V
DD_LV
supply for
flash program/erase
T
J
= 150
o
C——40mA