NXP Semiconductors MPC5777M - Page 151

Document revision history
MPC5777M Microcontroller Data Sheet, Rev. 6
NXP Semiconductors 151
3 3/2014
Package pinouts and signal descriptions
Section 2.1, Package pinouts:
• Removed “292” from the first sentence.
• Removed figure “292-ball BGA production device pinout (top view)” and figure
“292-ball BGA production device pinout (bottom view)”.
Table 2 (Power supply and reference pins) and Table 3 (System pins):
• Removed the “292PD” and 292ED” BGA ball columns.
•V
SS_LV
: Added K13 and K14 for 416PD/416ED. Added M15 and M16 for
512PD/512ED.
•V
DD_LV_BD
: R1/R4 now applies only to 416ED (416PD changed to “—”). M13/N12 now
applies only to 512ED (512PD changed to “—”).
• Removed V
DD_HV_OSC
row.
• Changed V
DD_HV_JTAG
Description to "JTAG/Oscillator power supply."
•V
DDSTBY
: removed "Input" from descripion.
• Significantly revised V
SS_HV_ADV_S
, V
DD_HV_ADV_S
, V
SS_HV_ADV_D
, and
V
DD_HV_ADV_D
rows. Added rows for V
SS_HV_ADR_S
, V
DD_HV_ADR_S
, V
SS_HV_ADR_D
,
V
DD_HV_ADR_D
.
Table 4 (LVDS pin descriptions):
• Changed title to “LVDS pin descriptions” (was “LVDSM”).
• Removed the “292 PD, 292 ED” BGA ball column.
• In the BGA ball (416 PD,416 ED) column, added ball locations.
• In the BGA ball (512 PD, 512 ED) column, added ball locations.
• Changed SIPI_TXP to P25 for 512BGA (was T25).
• DSPI 4: Changed SCK_N to G17 for 512BGA (was G18).
• DSPI 2: Changed SIN_P to G23 for 416BGA (was D17).
• DSPI 5: For SCK_P, changed PI[15] to PF[10], G26 to J24, and P22 to W24.
• DSPI 5: For SCK_N, changed PI[15] to PF[9], J23 to K23, and R22 to W25.
• Added another pair of SIN_P/SIN_N rows for DSPI_5.
Electrical characteristics—Absolute maximum ratings
Section 3.1, Introduction:
• Added V
DD_HV_IO_FLEXE
and V
DD_HV_IO_EBI
to list in supply pins note.
Table 7 (Parameter classifications):
• Changed Tag description for C classification to “Parameters are guaranteed. . .” (was
“Those parameters are achieved. . .”
• Changed Tag description for T classification to “Parameters are guaranteed. . .” (was
“Those parameters are achieved. . .”
Table 6 (Absolute maximum ratings):
• Changed V
SS
to V
SS_HV
.
• Removed “V
SS
– V
SS_HV_ADV
” parameter row.
• Removed V
FERS
row.
• Removed “VFERS is a factory test supply pin . . .” footnote.
•V
SS_HV_ADR
: Added "Reference to V
SS_HV
" to Conditions field.
• Removed V
SS
–V
SS_HV_ADR_D
and V
SS
–V
SS_HV_ADR_S
rows.
•In V
DD_HV_IO
footnote, added V
DD_HV_IO_JTAG
to list of power supplies to which
V
DD_HV_IO
applies.
• In ADC grounds footnote, removed V
SS_HV_ADV_D2
.
• In ADC supplies footnote, changed V
DD_HV_ADV
to V
DD_HV_ADV_S
.
• In ADC low and high references footnote, removed V
SS_HV_ADR_D2
and
V
DD_HV_ADR_D2
.
• In ADC supplies footnote, removed V
DD_HV_ADV_D2
.
Table 7 (ESD ratings,):
• Changed ESD for Human Body Model (HBM) parameter classification to “T” (was SR)
Table 76. Revision history (continued)
Revision Date Description of changes