NXP Semiconductors MPC5777M - Page 152

MPC5777M Microcontroller Data Sheet, Rev. 6
Document revision history
NXP Semiconductors152
3 3/2014
Electrical characteristics—Electromagnetic Compatibility (EMC)
• Removed section.
Electrical characteristics—Operating conditions
Table 8 (Device operating conditions):
•V
DDSTBY
added new footnote: The VDDSTBY pin should be connected to ground in
the application when the standby RAM feature is not used.'
• Added “Vin” specification, Min = 0V, Max = 5.5 V.
•V
DD_HV_ADV
changed Min value from 3.6 V to 3.7 V.
•V
DD_HV_IO_MAIN
, LVD400/HVD 600 disabled and LVD360/HVD600 disabled
conditions: changed max to “5.5 V” (was “5.9 V”).
•V
DD_HV_IO_MAIN
: Added footnote "VDD_HV_IO_MAIN range limited to 4.75–5.25 V
when FERS = 1 to enable the fast erase time of the flash memory."
•V
DD_HV_ADR_D
: Changed Typ value from V
DD_HV_ADV
to V
DD_HV_ADV_D
.
• Changed "V
DD_HV_ADR_D
–V
DD_HV_ADV
" parameter to
"V
DD_HV_ADR_D
–V
DD_HV_ADV_D
."
•V
SS_HV_ADR_D
: Changed V
SS_HV_ADV
to V
SS_HV_ADV_D
.
• Changed "V
SS_HV_ADR_D
–V
SS_HV_ADV
" parameter to
"V
SS_HV_ADR_D
–V
SS_HV_ADV_D
."
•V
DD_HV_ADR_S
: Added typ value of V
DD_HV_ADV_S
• Added V
SS_HV_ADR_S
parameter.
• Changed "V
DD_HV_ADR_S
–V
DD_HV_ADV
" parameter to "V
DD_HV_ADR_S
–V
DD_HV_ADV_S
"
• Changed "V
SS_HV_ADR_S
–V
SS_HV_ADV
" parameter to "V
SS_HV_ADR_S
–V
SS_HV_ADV_S
"
•For V
DD_HV_ADV
specification, changed parameter to “SARADC, SDADC,
Temperature Sensor, and Bandgap Reference supply voltage” (was SARADC and
SDADC). For LVD400 disabled and LVD360 disabled conditions, referenced new
footnote: “V
DD_HV_ADV_S
is required to be between 4.5V and 5.5V to read to read the
internal Temp Sensor and Bandgap Reference.”
• Changed V
RAMP
to V
RAMP_LV
, and changed parameter to “slew rate on core power
supply pins”.
• Added V
RAMP_HV
specification, parameter “Slew rate on HV power supply pins”, max
value 500 V/ms.
• Changed V
DD_HV_IO_JTAG
, V
DD_HV_IO_FLEX
, and V
DD_HV_IO_EBI
values from 4.0 V Min
to 4.5 V Min, and changed “5.9 V” Max to “5.5 V” Max.
•Moved V
REF_BG_T
, V
REF_BG_TC
and V
REF_BG_LR
specifications from ADC pin
specification table to Device operating conditions table.
• Removed footnote “Maximum frequency for the 292BGA is TBD, and may be lower
due to package thermal considerations.” from f
SYS
specification, Max value “300” MHz.
•V
DD_HV_ADV
changed “LVD400 disabled” condition to “LVD360 disabled” for the
3.7V-5.9 V case.
•V
DD_HV_IO_FLEXE
added specification.
•V
STBY_BO
and V
DD_LV_STBY_SW
removed from the Device operating conditions table
and added to the DC electrical specifications table.
•V
por_rel
and V
por_hys
specifications added.
• Removed V
FERS
row and associated footnote.
Table 9 (Emulation (buddy) device operating conditions):
• Changed V
DD_LV_BD
minimum value from blank to “1.2” V.
•V
DD_LV_BD
: Maximum changed to 1.365 V (was 1.32 V).
• Changed V
RAMP_BD
to V
RAMP_LV_BD
and added specification V
RAMP_HV_BD.
Table 76. Revision history (continued)
Revision Date Description of changes