© by SEMIKRON / 2017-09-07 / Technical Explanation / SKiiP
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7.12
Prevention of condensation ................................................................................................... 65
8.
Logistics .................................................................................................................................. 66
8.1
Label ................................................................................................................................. 66
8.1.1
System Label ................................................................................................................ 66
8.1.2
Half bridge Laser Label .................................................................................................. 67
8.1.3
Warranty Label ............................................................................................................. 67
8.1.4
Data Matrix Code .......................................................................................................... 67
8.1.5
Provisions and handling after use .................................................................................... 68
9.
Abbreviations ........................................................................................................................... 71
10.
Symbols .................................................................................................................................. 72
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