© by SEMIKRON / 2017-09-07 / Technical Explanation / SKiiP
4
Page 52/73
cooling plate as well as turbulators. The heat sink cooling channels of each half-bridge of the internal IGBT
power module are connected in serial. The cooling circuit contains following parts as shown in the table
below:
Part of cooling circuit Used material
heat sink plate EN AW-6060 T66 (AlMgSi 0,5 F22) if nothing else is specified
side parts EN AW-6060 T66 (AlMgSi 0,5 F22) if nothing else is specified
sealing gasket EPDM 70 Shore A
turbulators EN AW-5754 (AlMg3)
Figure 7.4: SKiiP
4 mechanical drawing
For the reduction of potential thermal stress tensions between side parts and main heat plate during
operation due to tolerances of the side parts and the heat plate a thermal stress release gap is designed in
for SKiiP4, as shown in the Figure 7.4. The SKiiP IPM shall be mounted by means of the fixing holes in the
side parts ensuring that constructed gap is unsupported. The parameters for vibration and shock are given
in Table 4—1. In case of usage of M8 screw (ISO 4762, strength class 8.8) the torque of 10…12Nm is
recommended.
Regarding the selection of the coolant type the used materials of the cooling circuit need to be considered.
The user has to ensure that the used coolant is compatible with the cooling circuit materials to avoid e.g.
corrosion or freezing at low temperatures. SEMIKRON proposes the usage of a mixture of water and glycol
with corrosion inhibitor. The percentage of glycol in the cooling medium shall be at least 10%. All thermal
performance data given in the corresponding SKiiP
®
4 data sheets assume a mixture of 50% water and
50% glycol if not otherwise specified.
For latest information and hints concerning cooling circuit / coolant please refer to SEMIKRON Application
manual for Power Semiconductors [2].
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