Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark
HCD-GT3D
83
R1161 1-216-864-11 SHORT CHIP 0
R1162 1-216-864-11 SHORT CHIP 0
R1163 1-216-864-11 SHORT CHIP 0
R1164 1-216-829-11 METAL CHIP 4.7K 5% 1/10W
R1165 1-216-832-11 METAL CHIP 8.2K 5% 1/10W
R1166 1-216-827-11 METAL CHIP 3.3K 5% 1/10W
R1167 1-216-827-11 METAL CHIP 3.3K 5% 1/10W
R1168 1-250-630-11 METAL CHIP 3.9K 1% 1/10W
R1169 1-216-827-11 METAL CHIP 3.3K 5% 1/10W
R1170 1-216-198-91 METAL CHIP 1K 5% 1/8W
R1171 1-216-198-91 METAL CHIP 1K 5% 1/8W
< RELAY >
RY001 1-755-307-21 RELAY
< TERMINAL >
TB001 1-780-932-11 TERMINAL BOARD
(MID/TWEETERS L/R IMPEDANCE USE 2Ω)
*************************************************************
LCD BOARD
*********
< CAPACITOR >
C3000 1-115-416-11 CERAMIC CHIP 0.001uF 5% 25V
C3001 1-116-734-11 CERAMIC CHIP 1uF 20% 16V
C3002 1-118-347-11 CERAMIC CHIP 0.1uF 10% 25V
C3008 1-118-347-11 CERAMIC CHIP 0.1uF 10% 25V
C3009 1-118-347-11 CERAMIC CHIP 0.1uF 10% 25V
C3010 1-162-919-11 CERAMIC CHIP 22PF 5% 50V
C3011 1-162-919-11 CERAMIC CHIP 22PF 5% 50V
C3012 1-162-919-11 CERAMIC CHIP 22PF 5% 50V
< CONNECTOR >
CN3000 1-779-550-21 CONNECTOR, FFC (LIF (NON-ZIF)) 13P
< DIODE >
D3001 6-503-770-11 DI 1L043RW32E0CIE11 (WHITE)
< IC >
IC3000 6-600-768-01 IC PNA4823M03S0 (
)
IC3004 6-720-239-01 IC BU9795AKS2
< JUMPER RESISTOR >
JR3000 1-216-296-11 SHORT CHIP 0
< LIQUID CRYSTAL DISPLAY >
ND3000 1-812-078-11 LIQUID CRYSTAL DISPLAY
< TRANSISTOR >
Q3000 6-552-936-01 TR LTC014EUBFS8TL
< RESISTOR >
R3000 1-216-809-11 METAL CHIP 100 5% 1/10W
R3001 1-216-805-11 METAL CHIP 47 5% 1/10W
R3002 1-216-811-11 METAL CHIP 150 5% 1/10W
R3003 1-216-815-11 METAL CHIP 330 5% 1/10W
R3004 1-216-817-11 METAL CHIP 470 5% 1/10W
R3011 1-216-296-11 SHORT CHIP 0
R3022 1-216-864-11 SHORT CHIP 0
R3025 1-216-296-11 SHORT CHIP 0
R3026 1-216-821-11 METAL CHIP 1K 5% 1/10W
R3028 1-216-821-11 METAL CHIP 1K 5% 1/10W
R3030 1-216-821-11 METAL CHIP 1K 5% 1/10W
R3033 1-216-809-11 METAL CHIP 100 5% 1/10W
R3034 1-216-864-11 SHORT CHIP 0
R3035 1-216-295-91 SHORT CHIP 0
*************************************************************
MIC BOARD
*********
< CAPACITOR >
C3201 1-124-463-00 ELECT 0.1uF 20% 50V
C3202 1-124-261-00 ELECT 10uF 20% 50V
C3203 1-100-756-91 CERAMIC CHIP 0.047uF 10% 50V
C3204 1-126-382-11 ELECT 100uF 20% 16V
C3206 1-115-872-11 ELECT 2.2uF 20% 50V
* C3207 1-116-720-11 CERAMIC CHIP 10uF 20% 6.3V
C3208 1-118-345-11 CERAMIC CHIP 0.01uF 10% 25V
C3210 1-124-463-00 ELECT 0.1uF 20% 50V
C3211 1-124-463-00 ELECT 0.1uF 20% 50V
C3215 1-162-925-11 CERAMIC CHIP 68PF 5% 50V
C3216 1-118-290-11 CERAMIC CHIP 0.001uF 10% 50V
C3217 1-162-960-11 CERAMIC CHIP 220PF 10% 50V
C3218 1-162-963-11 CERAMIC CHIP 680PF 10% 50V
C3221 1-118-347-11 CERAMIC CHIP 0.1uF 10% 25V
C3222 1-126-176-11 ELECT 220uF 20% 10V
C3223 1-118-347-11 CERAMIC CHIP 0.1uF 10% 25V
C3224 1-118-347-11 CERAMIC CHIP 0.1uF 10% 25V
C3225 1-126-176-11 ELECT 220uF 20% 10V
C3226 1-162-960-11 CERAMIC CHIP 220PF 10% 50V
C3227 1-118-290-11 CERAMIC CHIP 0.001uF 10% 50V
C3229 1-118-290-11 CERAMIC CHIP 0.001uF 10% 50V
C3230 1-115-872-11 ELECT 2.2uF 20% 50V
C3231 1-124-257-00 ELECT 2.2uF 20% 50V
C3232 1-115-872-11 ELECT 2.2uF 20% 50V
C3234 1-118-290-11 CERAMIC CHIP 0.001uF 10% 50V
C3235 1-118-290-11 CERAMIC CHIP 0.001uF 10% 50V
C3236 1-118-290-11 CERAMIC CHIP 0.001uF 10% 50V
C3237 1-118-290-11 CERAMIC CHIP 0.001uF 10% 50V
< CONNECTOR >
CN3200 1-564-720-11 PIN, CONNECTOR (SMALL TYPE) 4P
CN3203 1-822-423-11 CONNECTOR, USB (A) (REC/PLAY 5V 1A)
< DIODE >
D3200 6-502-970-01 DI DZ2J068M0L
D3201 6-502-961-01 DI DA2J10100L
D3202 6-502-970-01 DI DZ2J068M0L
D3204 6-502-970-01 DI DZ2J068M0L
D3205 6-500-400-01 DIODE BAV99-215
D3206 6-500-400-01 DIODE BAV99-215
D3207 6-500-400-01 DIODE BAV99-215
D3208 6-500-400-01 DIODE BAV99-215
D3209 6-500-400-01 DIODE BAV99-215
< FERRITE BEAD >
FB002 1-469-670-21 FERRITE, EMI (SMD) (2012)
FB003 1-469-670-21 FERRITE, EMI (SMD) (2012)
DAMP LCD MIC
Note : When the RY001 on the DAMP board is replaced,
spread the bond referring to “BOND FIXATION OF
ELECTRIC PARTS” on servicing notes (page 6).
Ver. 1.1
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