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General| Type | Oscilloscope |
|---|---|
| Bandwidth | 100 MHz |
| Channels | 2 |
| Vertical Sensitivity | 2 mV/div to 5 V/div |
| Time Base | 5 ns/div to 0.5 s/div |
| Sample Rate | 1 GS/s |
| Rise Time | 3.5 ns |
| Display | CRT |
| Input Impedance | 1 MΩ |
| Trigger Modes | Auto, Normal, Single |
| Trigger Sources | CH1, CH2, Line |
| Power Supply | 100-120 V / 220-240 V |
| Weight | 14 lbs (6.4 kg) |
Provides a general description of instrument functions and the basic block diagram.
Defines electrical characteristics, environmental conditions, and physical characteristics.
Details steps for preparing the instrument and proceeding with initial start-up.
General safety information for operating and servicing personnel.
Specifies the acceptable input voltage and source frequency range for continuous operation.
Describes the detachable three-wire power cord and its connection for electrical shock protection.
Explains the location and procedure for verifying or replacing the line-protection fuse.
Details precautions to prevent instrument damage from overheated components and airflow obstructions.
Describes the instrument's automatic power-up tests to verify functionality.
Provides instructions for repackaging the instrument for commercial transportation.
Familiarizes the operator with the location and function of instrument controls, connectors, and indicators.
Describes the functional overview and detailed explanation of each major circuit.
Explains digital logic conventions and linear device operations using waveforms.
Provides an overall functional description of the instrument, referring to block diagrams.
Describes signals applied to CRT, coupling options, and attenuator switching.
Explains horizontal deflection signals, preamplifiers, and mode switching.
Details the microprocessor's role in controlling digital storage and display operations.
Explains how input signals are selected, sampled, and digitized for storage.
Describes the transfer of digitized waveforms to acquisition memory.
Explains how the triggering circuitry develops trigger signals for sweep generation.
Describes how the A Sweep Generator and Logic circuits control sweep generation and timing.
Explains the Alternate B Sweep circuitry and its control over Nonstore B Sweeps.
Details horizontal deflection signals, preamplifiers, and mode switching.
Explains the microprocessor's control over digital storage and display.
Describes how input signals are selected, sampled, and digitized for storage.
Details the transfer of digitized waveforms to acquisition memory.
Explains the accurate frequency source for synchronizing the microprocessor with other digital devices.
Describes the custom IC that handles digital display generation, interfacing with display memory.
Explains how X- and Y-Axis analog signals are converted into vector signals to drive CRT deflection plates.
Details the Z-Axis Amplifier's input signals that control CRT intensity on a time-shared basis.
Defines CAUTION and WARNING statements regarding equipment damage or personal injury.
Explains CAUTION and DANGER indications marked on the equipment.
Indicates where cautionary or other information is found.
Defines symbols indicating DANGER (High voltage) and Protective ground.
Specifies the power source requirements and essential protective ground connection.
Explains grounding through the power cord and the importance of a properly wired receptacle.
Warns about electric shock hazard due to loss of protective ground connection.
Instructs to use only the specified power cord and connector, ensuring it is in good condition.
Advises using only the correct type, voltage, and current rating fuse to avoid fire hazards.
Caution against operating the product in an explosive atmosphere unless specifically certified.
Warns against removing covers or panels to avoid personal injury.
Recommends having another person present who can render first aid and resuscitation.
Warns about dangerous voltages and advises not to touch exposed connections or components.
Specifies the power source requirements and essential protective ground connection.
Explains the purpose and usage of the Performance Check Procedure.
States the procedure verifies Performance Requirements and determines calibration needs.
Recommends checking performance after every 2000 hours or annually, with more frequent checks for harsh environments.
Describes the procedure's structure in subsections for checking individual sections.
Lists all test equipment necessary for performance checks and adjustment procedures.
States that tolerances are valid for instruments operating within +20°C to +30°C after a 20-minute warm-up.
Notes that instrument covers do not need removal for checks, using operator-accessible controls.
Details the initial control settings and procedure steps for vertical checks.
Outlines initial control settings and procedure steps for horizontal checks.
Provides initial control settings and procedure steps for checking internal and external triggering.
Details initial control settings and procedure steps for checking external Z-axis, probe adjust, external clock, and X-Y plotter.
Explains the purpose of the Adjustment Procedure for returning the instrument to Performance Requirements.
States the procedure is for returning the instrument to conformance with Performance Requirements.
Describes the procedure's structure in subsections for independent adjustment of instrument sections.
Lists test equipment required for both Performance Check and Adjustment Procedures.
Specifies tolerances are valid for instruments operating within +20°C to +30°C after a 20-minute warm-up.
Identifies adjustments affected by repairs or component replacement, referencing Table 5-1.
Instructs to remove the instrument cabinet and lift the storage circuit board.
Details initial control settings and procedure steps for checking and adjusting power supply DC levels and CRT bias.
Provides initial control settings and procedure steps for vertical adjustments.
Details initial control settings and procedure steps for horizontal adjustments.
Outlines initial control settings and procedure steps for trigger adjustments.
Details initial control settings and procedure steps for external Z-axis, probe adjust, external clock, and X-Y plotter.
Provides precautions for handling semiconductor components to avoid damage from static discharge.
Covers cleaning, visual inspection, and performance checking to prevent instrument malfunction.
Addresses cabinet dust accumulation and front cover protection for storage or transport.
Details instrument inspection for damage and cleaning procedures for exterior and interior.
States that potentiometers are permanently seated and periodic lubrication is not recommended.
Recommends checking semiconductors through actual operation rather than periodic checks.
Recommends checking performance every 2000 hours or annually, and after component replacement.
Provides information to facilitate fault location, referencing Theory of Operation and Diagrams.
Introduces diagnostic routines for digital storage portions and schematic diagrams.
Explains power-up kernel tests and diagnostic routines for locating malfunctions.
Describes the location and identification of schematic diagrams and functional blocks.
Details replacement procedures for various types of mating connectors used for interconnecting pins.
Explains pin connectors used to connect wires to interconnect pins, including replacement procedures.
Describes removal, reinstallation, or replacement of grouped pin connectors.
Advises on replacing transistors and integrated circuits only if defective and checking performance.
Outlines general soldering techniques for maintaining instrument reliability and accuracy.
Provides guidance for removing and reinstalling subassemblies or components, referencing exploded view drawings.
Provides steps for removing and reinstalling the instrument cabinet.
Provides a general description of instrument options available at the time of publication.
Lists Tektronix part numbers for available power cords, with descriptive information in Section 2.
Describes the Travel Line option providing impact protection for industrial and service environments.
Introduces Option 10 (GPIB) and Option 12 (RS-232-C) for communications interface and memory.
Describes the standard side panel and options for Option 10 and Option 12 instruments.
Establishes primary talk and listen addresses for the oscilloscope, settable from 0 to 31.
Allows selection of EOI interface signal or Line-Feed (LF) character as the end-of-message terminator.
Establishes the baud rate used by the instrument for sending and receiving data.
Determines instrument response to received parity errors and parity of data sent by the instrument.
Allows selection of carriage return (CR) or CR and Line-Feed (LF) characters for message termination.
Explains the possibility of using multiple commands in one message separated by a semicolon.
Describes command format flexibility, accepting uppercase or lowercase ASCII characters.
Explains that arguments in brackets are defaults and omitting them selects the default.
Allows selection of GPIB parameters like address, terminator, and talk/listen mode using the switch.
Describes how SRQ is asserted for errors, and how EVENT? query returns specific error types.
Lists instrument diagnostic tests run automatically at power-up or manually via the menu.
Performs a quick check of dynamic RAM, ROM, and NMI circuitry; displays error codes if failures occur.
Explains how to select and use diagnostic routines from the front panel via the MENU.
Advises checking control settings to avoid false indications of instrument malfunction.
Recommends ensuring any connected equipment is operating correctly and signals are properly connected.
Describes component replacement and instrument repair procedures.
Lists precautions to reduce the possibility of personal injury or instrument damage during maintenance.
Explains how to obtain replacement parts through Tektronix or local commercial sources.
Highlights special parts manufactured or selected by Tektronix for specific performance requirements.
Specifies required information for ordering replacement parts from Tektronix.
Discusses components selectable for optimum circuit operation, usually adjusted during initial factory calibration.
Lists items required for maintenance procedures and suggests equivalent product substitutions.
Describes replacement procedures for various types of mating connectors used for interconnecting pins.
Explains pin connectors used to connect wires to interconnect pins, including replacement procedures.
Describes removal, reinstallation, or replacement of grouped pin connectors.
Advises on replacing transistors and integrated circuits only if defective and checking performance.
Outlines general soldering techniques for maintaining instrument reliability and accuracy.
Provides guidance for removing and reinstalling subassemblies or components, referencing exploded view drawings.
Provides steps for removing and reinstalling the instrument cabinet.
Contains a general description of instrument options available at the time of publication.
Lists Tektronix part numbers for available power cords, with descriptive information in Section 2.
Describes the Travel Line option providing impact protection for industrial and service environments.
Introduces Option 10 (GPIB) and Option 12 (RS-232-C) for communications interface and memory.
Describes the instrument's side panel, including auxiliary connectors, GPIB, and RS-232-C interfaces.
Establishes primary talk and listen addresses for the oscilloscope, settable from 0 to 31.
Allows selection of EOI interface signal or Line-Feed (LF) character as the end-of-message terminator.
Establishes the baud rate used by the instrument for sending and receiving data.
Determines instrument response to received parity errors and parity of data sent by the instrument.
Allows selection of carriage return (CR) or CR and Line-Feed (LF) characters for message termination.
Explains the possibility of using multiple commands in one message separated by a semicolon.
Describes command format flexibility, accepting uppercase or lowercase ASCII characters.
Explains that arguments in brackets are defaults and omitting them selects the default.
Allows selection of GPIB parameters like address, terminator, and talk/listen mode using the switch.
Describes how SRQ is asserted for errors, and how EVENT? query returns specific error types.
Instrument parameters are set manually; only option interface messages are executed.
Oscilloscope executes all commands addressed via communication options bus.
Explains effects on the oscilloscope of standard interface messages received from a remote controller.
Local Lockout is not supported; response to LLO via GPIB generates an SRQ error.
Asserting REN places oscilloscope in Remote State (REMS); changing front-panel controls returns it to Local State.
Instruments that are already listen-addressed respond to GTL by assuming a local state.
Explains primary Talk/Listen address establishment and the effect of UNL and UNT messages.
When UNL is received, oscilloscope's listen function is placed in an idle state; UNT places talk function in idle state.
When IFC is asserted, Talk and Listen functions are idled, and ADDR indicator is turned off.
Reinitializes communication, clears messages, unexecuted settings, and power-on events.
Performs the same function as DCL, but only instruments that have been listen-addressed respond.
SPE enables instrument to transmit serial-poll status byte; SPD switches it back to normal operation.
Covers GPIB Option and RS-232-C performance check procedures against Table 7-4 requirements.
States limits and tolerances are instrument specifications from Table 7-4, valid under specific ambient conditions.
Lists required test equipment and their minimum specifications from Table 7-37.
Details steps for setting RS-232-C parameters, front panel controls, and connecting the controller via GPIB cable.
Outlines steps for setting RS-232-C parameters, front panel controls, and sending an ID query from the controller.
States there are no adjustment procedures for the GPIB and RS-232-C Options.
Provides information on battery replacement and maintenance procedures applicable to Options.
Discusses additional diagnostics for Option 10 or 12, describing each diagnostic separately.
Tests the Option RAM and microprocessor interface, filling memory with a checkerboard pattern.
Provides information on ordering replacement parts from Tektronix or local representatives.
Lists assemblies in numerical order to identify the assembly containing a known component number.
Provides an index of manufacturer codes to names and addresses for component sourcing.
Lists abbreviations conforming to American National Standard Y1.1.
Explains the numbering method used to identify assemblies, subassemblies, and parts.
Indicates the part number to be used when ordering replacement parts from Tektronix.
Indicates serial numbers at which parts were first used or removed.
Provides item names separated from descriptions by a colon.
Indicates the code number of the actual manufacturer of the part.
Indicates the actual manufacturer's part number.
Attaching parts for Assembly and/or Component.
Attaching parts for Detail Part.
Attaching parts for Parts of Detail Part.
