Manual 26166V1 MicroNet Simplex & MicroNet Plus
Woodward 26
3.3—Module Replacement
Chapter 15 contains Installation and Replacement procedures for VME Modules, power supplies, relay
boxes, and other devices. Individual CPU and I/O module sections in Chapters 6 through 9 are an additional
reference for installation and replacement information.
Sections 5.2 and 5.4 contain additional details for power supply installation and replacement. Note that
power must be removed from the power supply input before a module is removed or inserted.
Live insertion and removal of a CPU or Remote RTN module in the
MicroNet Simplex chassis is not recommended. Remove power to the
chassis before insertion or removal. This process ensures that all I/O
modules will be placed into a known I/O LOCK state upon power down.
3.4—Latent Fault Detection
Because a redundant system can tolerate some single faults, it is possible for a fault to go undetected.
Undetected faults are termed latent faults. If another fault occurs when a latent fault exists, the second fault
could cause a shutdown. It is important to detect a latent fault in a redundant system so that it may be repaired
before another fault occurs. Without a fully triplicated system, it is not possible to detect all latent faults,
however most faults can be detected. For single or redundant I/O points, fault detection is dependent on the
application software to detect its I/O faults.
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