CP3003-SA CP3003-XMC
ID 1052-6929, Rev. 3.0 Page B - 3
D R A F T — F O R I N T E R N A L U S E O N L Y
B. CP3003-XMC Module
B.1 Overview
The CP3003-XMC module provides an XMC mezzanine interface for support of one x8, x4 or x1
PCI Express 2.0 XMC module. In addition, the CP3003-XMC module provides a socket for CFast
memory cards. The CP3003-XMC module expands the CP3003-SA board from 4 HP to 8 HP.
B.2 Technical Specifications
Note ...
XMC modules providing support for one x8 PCI Express 2.0 interface with up
to 5.0 GT/s, compliant with the ANSI/VITA 42.0 and ANSI/VITA 42.3 specifica-
tions, and with a power consumption of up to 15 W can be used on the CP3003-
XMC module.
Note ...
If the CP3003-XMC module is mounted on the CP3003-SA, the SATA Flash
module/Smart Extension Module cannot be used with the CP3003-SA.
Table B-1: CP3003-XMC Module Specifications
CP3003-XMC SPECIFICATIONS
Onboard
Interfaces
XMC XMC connector, J1, for connecting an XMC module to the CP3003-XMC module
CFast One CFast card socket, J2
Board-to-Board Two board-to-board connectors for connecting the CP3003-XMC module to the
CP3003-SA:
• One 60-pin, high-speed PCI Express extension connector, J5
• One 120-pin, high-speed I/O extension connector, J6
Indicators/
Switches
HDD LED One LED (green) for monitoring SATA HDD/SSD activity
Front Panel Switch Reset button, guarded
General
Power Consumption Power consumption without hard disk, CFast card and peripheral devices connected:
50 mA at 3.3 V
50 mA at 5 V
Temperature Range Operational: 0°C to +60°C Standard
-40°C to +85°C Extended (with CP3003-SA and Intel® Core™
i7-3517UE, 1.7 GHz ULV processor only)
Storage: -40°C to +85°C
-40°C to +65°C
Climatic Humidity 93% RH at 40°C, non-condensing (acc. to IEC 60068-2-78)
Dimensions Dimensions: 100 mm x 158 mm
Board Weight 426 grams (8 HP CP3003-SA with CP3003-XMC, heat sink, front panel, two 2 GB
SODIMM memory modules and battery, but without CFast card)