Kontron CP3003-SA - Page 6

Preface CP3003-SA
Page vi ID 1052-6929, Rev. 3.0
D R A F T — F O R I N T E R N A L U S E O N L Y
4.2.4 Control Register 1 (CTRL1) ............................................................4 - 7
4.2.5 Device Protection Register (DPROT) ..............................................4 - 8
4.2.6 Reset Status Register (RSTAT) .......................................................4 - 9
4.2.7 Board Interrupt Configuration Register (BICFG) ...........................4 - 10
4.2.8 Status Register 2 (STAT2) .............................................................4 - 11
4.2.9 Board ID High Byte Register (BIDH) .............................................4 - 11
4.2.10 Board and PLD Revision Register (BREV) ...................................4 - 12
4.2.11 Geographic Addressing Register (GEOAD) ..................................4 - 12
4.2.12 Board ID Low Byte Register (BIDL) ..............................................4 - 12
4.2.13 Watchdog Timer Control Register (WTIM) ....................................4 - 13
4.2.14 LED Configuration Register (LCFG) .............................................4 - 15
4.2.15 LED Control Register (LCTRL) .....................................................4 - 16
4.2.16 General Purpose Output Register (GPOUT) .................................4 - 17
4.2.17 General Purpose Input Register (GPIN) .......................................4 - 18
5. Power Considerations ............................................................. 5 - 3
5.1 System Power ..........................................................................................5 - 3
5.1.1 CP3003-SA Baseboard ...................................................................5 - 3
5.1.2 Backplane .......................................................................................5 - 4
5.1.3 Power Supply Units .........................................................................5 - 4
5.1.3.1 Start-Up Requirement .............................................................5 - 4
5.1.3.2 Power-Up Sequence ...............................................................5 - 4
5.1.3.3 Tolerance ................................................................................5 - 5
5.1.3.4 Regulation ...............................................................................5 - 5
5.2 Power Consumption ................................................................................5 - 6
5.3 Power Consumption of CP3003-SA Accessories ....................................5 - 8
5.4 Maximum Power Consumption of XMC Modules ....................................5 - 8
6. Thermal Considerations ......................................................... 6 - 3
6.1 Board Internal Thermal Monitoring ..........................................................6 - 3
6.2 Processor Thermal Monitoring .................................................................6 - 3
6.2.1 Digital Thermal Sensor (DTS) .........................................................6 - 3
6.2.2 Adaptive Thermal Monitor ...............................................................6 - 3