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LSIS XEC-DR32H User Manual

LSIS XEC-DR32H
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Chapter 9 Installation and Wiring
9.3.2 I/O Device wiring
(1) The size of I/O device cable is limited to 0.3~2 mm
2
but it is recommended to select a size(0.3 mm
2
) to use
conveniently.
(2) Please isolate input signal line from output signal line.
(3) I/O signal lines should be wired 100mm and more away from high voltage/high current main circuit cable.
(4) Batch shield cable should be used and the PLC side should be grounded unless the main circuit cable and
power cable can not be isolated.
(5) When applying pipe-wiring, make sure to firmly ground the piping.
9.3.3 Grounding wiring
(1) The PLC contains a proper noise measure, so it can be used without any separate grounding if there is a
large noise. However, if grounding is required, please refer to the followings.
(2) For grounding, please make sure to use the exclusive grounding.
For grounding construction, apply type 3 grounding(grounding resistance lower than 100 )
(3) If the exclusive grounding is not possible, use the common grounding as presented in B) of the figure below.
A) Exclusive grounding : best B) common grounding : good C) common grounding: defective
(4) Use the grounding cable more than 2 mm
2
. To shorten the length of the grounding cable, place the grounding
point as close to the PLC as possible.
(5) If any malfunction from grounding is detected, separate the FG of the base from the grounding.
input
output
PLC
Shield cable
RA
DC
PLC
Other devices
PLC
PLC
Other devices
Other devices
Type 3 Grounding
Type 3 Grounding
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LSIS XEC-DR32H Specifications

General IconGeneral
BrandLSIS
ModelXEC-DR32H
CategoryController
LanguageEnglish

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