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General| Nozzle Diameter | 0.5 mm (standard), interchangeable |
|---|---|
| Print Speed | Up to 200 mm/s |
| Max Hotend Temperature | 300°C |
| Max Heated Bed Temperature | 120°C |
| Connectivity | USB |
| Supported Materials | PLA, ABS, HIPS, PVA, PETG, Nylon, TPE, TPU, PC, wood-filled |
| Print Surface | PEI-coated borosilicate glass bed |
| Bed Leveling | Automatic |
| Operating System Compatibility | Windows, macOS, Linux |
| Power Requirements | 100 - 240 VAC |
| Print Technology | Fused Deposition Fabrication (FDM) |
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