Mirae Mx200 - Mx-Series Specification Sheet-Mx200;P;TP

Power requirements
3phase, 50/60 Hz
208V/220V/230V/240V
Option: 380V/400V/415V
Power consumption
About 3.0 KVA
Air consumption
About 130 Nl/min
About 90 Nl/min
Ambient Temperature & Humidity
15℃~32 ,℃ 30~75% (No dewdrops should form)
Weight (approx.)
1,200 Kg
Dimension (W×D×H),
Cover Only
1,202 ×1,900 × 1,500mm
Appendix A-2
A. Mx-Series Specification Sheet-Mx200/P/TP
Model Name
Mx200
Mx200P(TP)
Tact time
Chip(1005)
0.18 sec/chip
CPH : 21,000 (IPC9850)
Optimal: 0.24
sec/chip CPH :
15,000 (IPC9850)
Head
Head Type
6 Module Head
4 Module Head+1 Precision Head (3
Precision Head)
Number of Axes
※ R= Rotate
※ P= Precision
6 Z-Axis, 1 R-Axis
4 Z-Axis, 1R-Axis,1PZ-Axis, 1PR-Axis
(3PZ-Axis, 3PR-Axis)
Z axis Acceleration
7g
Placing
Accuracy
Chip(3σ)
±0.065mm
±0.065mm,( N/A)
QFP(3σ)
N/A
±0.025mm
Board
Transfer
Transport Type
Buffered 3 stage
Speed (Maximum)
500mm/sec,Programable (3 stages: High, medium and low speeds)
Fixed Conveyor Edge
Front (Standard)
/ Rear (Option)
Board Clamping
Edge Clamps
Board Support
Push-up Pins
Transport Features
Manual Adjust
Upper limit/Lower limit
Chip:10 mm,Precision:20 mm/19.5mm
Other Features
-
Board size
50×50 ~
410×460mm(16.1"*18.1")
t:0.4 ~ 5.0mm(About 3Kg)
Components
Chip Size
0603 ~ 18×18 mm
0603 ~ 23×23 mm
Max Size
18mm (0.708”) square
32mm (0.71”) square (Single FOV)
50mm (1.97”) square (Multiple FOV)
Height
10mm
10mm/20mm
Number of components
(8mm feeder)
80 (Front : 40, Rear : 40)