Mirae Mx200 - Work Flow; Specification

Chapter 4 Mx-Series Unit Description 4-
9
• Work Flow
- SINGLE CONVEYOR : ENTRANCE CONVEYOR (PCB LOADING) 
WORK
CONVEYOR (Component placement)  EXIT CONVEYOR(PCB
UNLOADING)
- DUAL CONVEYOR: INLET CONVEYOR(PCB LOADING &
DISTRIBUTING)  WORK
CONVEYOR (Component placement –Dual placement for a PCB smaller
than 250mm) OUTLET CONVEYOR (PCB UNLOADING &
DISTRIBUTING)
• Specification
<Table 4-1> summarizes the PCB conveyer specification of Mx-Series SMD
Placement System.
<Table 4-1 Mx-Series PCB conveyer specification>
Parameter
Specification
Board
Size
Maximum (L x W)
410mm x
460mm(Single):Mx100/P/200/P/TP
410 x 250mm(Dual):Mx400/P/S/PS
640 x250mm(Dual Option)
Minimum (L x W)
50mm x 50mm
Max Thickness
(including warp age)
5.0mm
Min Thickness
0.4mm
Board
Transfer
Stage Count
Buffered 3 Stage
Height
952.50 mm ± 12.70mm (37.50 ± 0.50 inch) :
SMEMA
900mm + 30mm/-10mm( 35.43" + 1.18" / -
0.39"): Option
Board Flow Direction
Left -> Right (Right -> Left: Option)
Conveyer Transfer Rate
500mm/sec (20"/sec)