7-4 Maintenance – EP350 (Limited Keypad Model): Repair Procedures and Techniques – General
Parts Replacement and Substitution
When damaged parts are replaced, identical parts should be used. If the identical
replacement part is not locally available, check the parts list for the proper Motorola part number.
Orders for replacement parts which are listed in the “Parts List” section of this manual, should be
placed directly on Motorola’s local distribution organization or via Motorola Online
Rigid Circuit Boards
This family of radios uses bonded, multi-layer, printed circuit boards. Since the inner layers are not
accessible, some special considerations are required when soldering and unsoldering components.
The printed-through holes may interconnect multiple layers of the printed circuit. Therefore, exercise
care to avoid pulling the plated circuit out of the hole.
When soldering near the connector pins:
• Avoid accidentally getting solder in the connector.
• Be careful not to form solder bridges between the connector pins.
• Examine your work closely for shorts due to solder bridges.
Chip Components
Use the RLN4062 Hot-Air Repair Station for chip component replacement. Adjust the temperature
control to 390 °C (735 °F), and adjust the airflow to a minimum setting. Airflow can vary due to
component density.
• To remove a chip component:
1. Use a hot-air hand piece and position the nozzle of the hand piece approximately 0.3 cm
(1/8") above the component to be removed.
2. Begin applying the hot air. Once thde solder reflows, remove the component using a pair
of tweezers.
3. Using a solder wick and a soldering iron or a power desoldering station, remove the
excess solder from the pads.
• To replace a chip component using a soldering iron:
1. Select the appropriate micro-tipped soldering iron and apply fresh solder to one of the
solder pads.
2. Using a pair of tweezers, position the new chip component in place while heating the
fresh solder.
Table 7-14. Lead Free Solder Wire Part Number List
Motorola
Part Number
Alloy Flux Type
Flux Content
by Weight
Melting
Point
Supplier Part
number
Diameter Weight
1088929Y01 95.5Sn/3.8Ag/0.7Cu RMA Version 2.7-3.2% 217C 52171 0.015” 1lb spool
Table 7-15. Lead Free Solder Paste Part Number List
Motorola
Part Number
Manufacturer Part
Number
Viscosity Type Composition & Percent Metal
Liquidus
Temperature
10-856-
74C03
NC-SMQ230 900-1000KCPs
Brookfield(5rpm)
Type 3
(
-325/+500)
95.5%Sn-3.8%Ag-0.7%Cu
89.3%
217 Degree C
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