NXP Semiconductors MPC5746R - Thermal Characteristics

If you want the drawing for this package Then use this document number
LQFP 144 PD 98ASS23177W
LQFP 176 PD 98ASS23479W
MAPBGA 252 PD 98ASA00468D
MAPBGA 292 ED 98ASA00261D
20 Thermal characteristics
The following tables describe the thermal characteristics of the device.
Junction temperature is a function of die size, on-chip power dissipation, package thermal
resistance, mounting side (board) temperature, ambient temperature, air flow, power
dissipation or other components on the board, and board thermal resistance.
Table 56. Thermal characteristics for the 144-pin LQFP package
Rating Conditions Symbol Value Unit
Junction to Ambient Natural Convection
1, 2
Single layer board (1s) R
θJA
41.3 °C/W
Junction to Ambient Natural Convection
1, 2, 3
Four layer board (2s2p) R
θJA
33.0 °C/W
Junction to Ambient (@200 ft/min)
1, 3
Single layer board (1s) R
θJMA
32.4 °C/W
Junction to Ambient (@200 ft/min)
1, 3
Four layer board (2s2p) R
θJMA
26.7 °C/W
Junction to Board
4
— R
θJB
21.5 °C/W
Junction to Case
5
— R
θJC
7.0 °C/W
Junction to Package Top
6
Natural Convection ψ
JT
0.25 °C/W
Junction to Package Lead
7
Natural Convection ψ
JB
16.5 °C/W
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured
on the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2.
7. Thermal characterization parameter indicating the temperature difference between package bottom center and the junction
temperature per JEDEC JESD51-12.
Table 57. Thermal characteristics for the 176-pin LQFP package
Rating Conditions Symbol Value Unit
Junction to Ambient Natural Convection
1, 2
Single layer board (1s) R
θJA
49.9 °C/W
Junction to Ambient Natural Convection
1, 2, 3
Four layer board (2s2p) R
θJA
33.8 °C/W
Table continues on the next page...
Thermal characteristics
SPC5746R Microcontroller Data Sheet, Rev. 6, 06/2017
NXP Semiconductors 87