NXP Semiconductors MPC5746R - Page 88

Table 57. Thermal characteristics for the 176-pin LQFP package (continued)
Rating Conditions Symbol Value Unit
Junction to Ambient (@200 ft/min)
1, 3
Single layer board (1s) R
θJMA
37.8 °C/W
Junction to Ambient (@200 ft/min)
1, 3
Four layer board (2s2p) R
θJMA
28.2 °C/W
Junction to Board
4
— R
θJB
21.0 °C/W
Junction to Case
5
— R
θJC
7.8 °C/W
Junction to Package Top
6
Natural Convection ψ
JT
0.3 °C/W
Junction to Package Lead
7
Natural Convection ψ
JB
13.0 °C/W
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured
on the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2.
7. Thermal characterization parameter indicating the temperature difference between package bottom center and the junction
temperature per JEDEC JESD51-12.
Table 58. Thermal characteristics for the 252-pin MAPBGA package with full solder balls
Rating Conditions Symbol Value Unit
Junction to Ambient Natural Convection
1, 2
Single layer board (1s) R
θJA
43.0 °C/W
Junction to Ambient Natural Convection
1, 2, 3
Four layer board (2s2p) R
θJA
26.5 °C/W
Junction to Ambient (@200 ft/min)
1, 3
Single layer board (1s) R
θJMA
33.2 °C/W
Junction to Ambient (@200 ft/min)
1, 3
Four layer board (2s2p) R
θJMA
22.2 °C/W
Junction to Board
4
— R
θJB
12.5 °C/W
Junction to Case
5
— R
θJC
6.3 °C/W
Junction to Package Top
6
Natural Convection ψ
JT
0.3 °C/W
Junction to Package Lead
7
Natural Convection ψ
JB
8.7 °C/W
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured
on the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2.
Thermal characteristics
SPC5746R Microcontroller Data Sheet, Rev. 6, 06/2017
88 NXP Semiconductors