1. "PD" refers to a production device, orderable in quantity.
2. “ED" refers to an emulation device, orderable in limited quantities. An emulation device (ED) is for use during system
development only and is not to be used in production. An ED is a Production PD chip combined with a companion chip to
form an Emulation and Debug Device (ED) and includes additional RAM memory and debug features. EDs are provided
“as is" without warranty of any kind. In the event of a suspected ED failure, NXP agrees to exchange the suspected failing
ED from the customer at no additional charge, however NXP will not analyze ED returns.
22 Revision history
Table 61. Revision history
Revision Date Description of changes
1 05/2013 Initial release.
2 12/2014 Overall:
• Editorial changes.
• Removed the Classification columns in spec tables and removed statements that values need
to be characterized.
• In footnotes changed cross references to figures to static text.
In section Block diagram :
• In Figure 1, changed "AIPS Bridge 0/1" to "AIPS PBridge_0/1".
• In Figure 2 :
• Changed figure title (was “Peripherals block diagram”).
• Changed "BAF" to "BAR".
• Added PBRIDGE_1, EIM, XBAR, and PBRIDGE_0.
In section Introduction, removed section "Parameter classification".
In section Absolute maximum ratings, Table 1 :
• VDD_HV_IO_FEC spec: removed row for "Using Ethernet Reference to VSS" condition.
• Corrected "VIDD_HV_IO_MSC" to "VDD_HV_IO_MSC".
• Add parameter IIOMAX.
• Deleted IMAXSEG parameter.
In section Operating conditions :
• Deleted sentence "The ranges in this table are design targets...".
• Added a NOTE that all power supplies need to be powered up.
• In Table 3 :
• Removed VDD_HV_FLA.
• Changed minimum voltage of VDD_HV_ADV_SD.
• Modified footnote for S/D ADC supply voltage.
• Modified footnote for SAR ADC supply voltage.
• Modified VRAMP spec to two separate specs for "VRAMP_VDD_LV" and
"VRAMP_VDD_HV_IO_MAIN, VRAMP_VDD_HV_PMC".
In section DC electrical specifications :
• Removed the statement that the ranges are design targets.
• In Table 5 :
• Modified I
DD_LV
to show specs depending on device model. Modified footnote.
• Removed the “PMC only” row of the IDD_HV_PMC “internal core reg bypassed” spec.
• Removed IDD_MAIN_CORE_AC.
• Removed IDD_LKSTP_AC.
• Changed I
DDSTBY_ON
value at 40 °C.
• Changed I
DDSTBY_REG
parameter to "32 KB RAM Standby Regulator Current" (was
"Standby Leakage Current"); changed condition to "V
DDSTBY
@1.2 V to 5.9 V, Tj =
150C" (was "V
DDSTBY
@1.3 V...")
Table continues on the next page...
Revision history
SPC5746R Microcontroller Data Sheet, Rev. 6, 06/2017
NXP Semiconductors 91
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