NXP Semiconductors MPC5777M - Page 161

Document revision history
MPC5777M Microcontroller Data Sheet, Rev. 6
NXP Semiconductors 161
3 3/2014
Package characteristics
Section 4, Package characteristics:
• Removed the “292 MAPBGAcase drawing” figures.
• Table 73 (Package case numbers): Removed the 292MAPBGA row.
Electrical characteristics—Thermal Characteristics
Table 74 (Thermal characteristics):
• Removed “292 Value” column.
Ordering Information
Table 75 (Orderable part number summary)
• Changed Freescale part numbers: 416 MAPBGA PD to TEPBGA
“PPC5777MK0MVU8A” (was PPC5777MQK0MVU8), 512 TEPBGA PD to
“PPC5777MK0MVA8A” (was PPC5777MQK0MVA8), 416 MAPBGA ED to TEPBGA
“PPC5777M2K0MVU8A” (was PPC5777M2K0MVU8), and 512 TEPBGA ED to
“PPC5777M2K0MVA8A” (was PPC5777M2K0MVA8)
• Removed KGD and Production PD rows.
• Removed “Flash/SRAM,” “Emulation RAM,” and “Frequency” columns.
Figure 61 (Product code structure):
• Package Code, added “VA = 512 TEPBGA Pb-Free”.
• Package Code, added “VU = 416 TEPBGA Pb-Free”.
• Miscellaneous, added “2 = Emulation Device”.
• Changed “Tape and Reel” to “Suffix” and added “A = cut2.0 revision”.
• In “Fab and Mask Revision” codes, changed “K = TBD” to “K = TSMC.”
4 9/2014
Throughout
• Removed parameter classifications from specification tables.
• Editorial changes and improvements.
Introduction
•In Figure 1 (Block diagram), added “LFAST & SIPI” block to 50 MHz concentrator.
•In Figure 2 (Periphery allocation), changed block to “2 x SIPI” (was “SIPI_0)” and
removed double arrow on its right side.
Electrical characteristics—Operating conditions
• Extensive revisions to Table 8 (Device operating conditions).
Table 76. Revision history (continued)
Revision Date Description of changes