Jackson User Manual rev 2.2 www.diamondsystems.com Page 48
12 HEAT SINK
The Jackson heat sink is constructed of a single piece of aluminum with Black anodized finish. The custom
shaped heat sink has a form factor of 90mm x 50mm. This enlarged sized extends past the edges of the Orin
module to provide increased heat dissipation compared to common module-sized heat sinks. The heat sink uses
a thermal pad with 1mm thickness to contact the Jetson processor chip on the Orin module.
The heat sink mounts to the Jackson board in 4 locations: 2 on top of the Orin module mounting holes (which are
mounted on standoffs on the carrier board) and two additional points directly on the carrier board. In this way all
the weight of the heat sink is carried by the carrier board, and no stress is placed on the Orin module or its
SODIMM connector.
The heat sink contains a recess in the middle with four M2.5 threaded bosses. These bosses are used to mount
an optional fan in the heat sink to act as an active thermal solution.
Figure 12-1: Heat sink (DSC part no. 6882650)
Figure 12-2: Heat sink with fan (DSC part no. 6882651)
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