Why Inficon IC6 displays 'Abbreviated Average'?
The Inficon Controller displays 'Abbr(eviated) Average' during a rate control state when a crystal failure occurred after more than one minute but before the time specified in the Time Power Averaging Time parameter, meaning the time to average the rate and power is less than requested. This message disappears when a new layer is started or after a Stop/Reset.
What does 'No or Neg. Average' mean on Inficon IC6 Controller?
The Inficon Controller displays 'No or Neg. Average' when entering time power of non deposit control and there is not enough data to calculate an average rate or power. This message disappears as the layer is unloaded.
What does 'Time Power Complete' mean on Inficon IC6?
The Inficon Controller displays 'Time Pwr (Power) Complete' when Time Power was active when the Material completed. This message disappears when another layer overloads the layer that completed in Time Power.
What does 'Recoder Conflict' mean on Inficon Controller?
The 'Recoder Conflict' message on the Inficon Controller indicates that a DAC output is set as a Recorder output on two or more loaded materials or sensors. The message disappears when the conflict has been removed.
Why Inficon IC6 Controller displays 'Unable to Auto-Z'?
The Inficon Controller displays 'Unable to Auto-Z' when an active sensor is unable to Auto-Z. This message disappears when a sensor is no longer active or is able to Auto-Z, or when the Sensor Parameter Auto-Z is set to No.
General| Brand | Inficon |
|---|---|
| Model | IC6 |
| Category | Controller |
| Language | English |
Overview of the IC6 as a closed loop process controller for thin film deposition.
Details definitions of Notes, Cautions, Warnings, and general safety information.
Information on contacting INFICON for support, sales, and repair services.
Comprehensive technical details including measurement capabilities, features, and physical properties.
Procedures for safely removing the IC6 from its packaging and inspecting for shipping damage.
Details base configurations, pre-installed options, and optional accessories for the IC6.
Steps for performing a preliminary functional check of the IC6 before formal installation.
Recommendations for properly installing the IC6 for optimal performance and longevity.
Guidelines for minimizing electrical noise and ensuring proper shielding and grounding.
Information on connecting power and signal interfaces to the IC6 and owner equipment.
Identifies and describes the functions of all controls located on the IC6 front panel.
Outlines the various interfaces and connectors available on the rear panel of the IC6.
Explains the different display screens for monitoring and programming processes.
Explains how the IC6 allows sequential deposition control and co-deposition features.
Explains the various states of operation for the IC6, including conditions and relay contact status.
Highlights special features like Crystal Switching, Source/Crucible Selection, Auto-Z, and Auto Tuning.
Overview of the IC6 sensor measurement capabilities and configuration process.
Overview of configuring the six source control channels of the IC6.
Rules governing the use of DAC outputs for rate control or recorder functions.
Information on storing and defining parameters for up to 32 materials.
Process for defining materials, including chemical formula, density, and Z-Ratio.
Parameters related to source configuration for each material, including power limits and recorder settings.
Parameters for selecting sensors, tooling factors, and multipoint averaging for material control.
Parameters for controlling deposition rate, time limits, and final thickness actions.
Overview of storing parameters for up to fifty processes, each with up to 200 layers.
Shows the layer sequence for the current or last edited process.
Details how to define and edit layer parameters within a process.
Covers features like Skip Deposit for controlling layer processing.
Overview of top-level parameters that define the controller's system-level activities.
Details parameters for Active Process, Layer to Start, Auto Start Next, and Max Concurrent Layer.
Settings for datalogging, RS-232, and Ethernet communication parameters.
How to enable and configure the software-controlled test mode for operation verification.
Setting up program and file access codes to prevent unauthorized parameter changes.
Overview of the Digital I/O screen for configuring inputs and outputs on I/O boards.
Displays all assigned input names and indicates active inputs with darker font.
Displays all assigned output names and indicates active outputs with darker font.
Details the mapping of names and output types for each I/O board.
Explains how to use programmable logic capabilities to control processes without operator intervention.
Steps for accessing and editing logic statements, including viewing groups and individual statements.
Lists and explains various event conditions that can be used in the IF part of a logic statement.
Lists and explains various actions that can be triggered by the THEN part of a logic statement.
A step-by-step example of creating a logic statement for process automation.
Describes how to remotely control, program, or interrogate the IC6 using a command set.
Details the available hardware ports for data communication: RS-232C and optional TCP/IP.
Explains the structure of commands and responses for remote communication protocols.
Lists and describes the various query, update, status, and action commands for remote control.
Explains how to use multiple sensors for monitoring and controlling deposition processes.
How to output rate and thickness information from sensors to DAC outputs for analysis.
Features of the IC6 that support Cygnus applications in OLED manufacturing.
Guidance on configuring the IC6 for simultaneous multi-layer or co-deposition processes.
Explains how density, tooling, and Z-Ratio are crucial for accurate thickness measurements.
Step-by-step procedure for determining the film's bulk density value.
Procedure for calculating the tooling factor to account for material flow differences.
Method for determining Z-Ratio values, including direct measurement and formula calculation.
Feature for automatically characterizing system response and optimizing control loop parameters.
Feature to eliminate interference between sensors in co-deposition processes.
Procedures for toggling shutters, rotating crucible indexers, and adjusting source power.
Shows installed option boards and firmware versions for system diagnostics.
Overview of the IC6's counters and timers for customizing logic statements and process control.
Information on using the USB port for configuration files, screen captures, and data logs.
How to save and retrieve IC6 configurations to a USB storage device.
Details on how data log files are generated, named, and stored on the USB device.
How to capture and save screen images to the USB device, including file naming and deletion.
Lists status messages with designators for Material, Source, or Sensor, and their remote encodings.
Explains causes of STOP messages and their designators for Material, Source, or Sensor.
Temporary messages displayed as conditions occur, removed by key press or new message.
Error messages for invalid parameter entries, indicating input errors with color changes.
Symptom/Cause/Remedy charts to help diagnose and resolve IC6 operational issues.
Procedures for replacing crystals in various sensor types like Front Load, Cool Drawer, and Sputtering.
Using the Crystal Sensor Emulator for diagnosing measurement system problems and specific diagnostic procedures.
Fundamental principles of quartz crystal microbalance operation and measurement.
Explanation of the Z-match equation and its use in calculating deposition Z-Ratio.
Theoretical basis for the Auto-Z feature and conditions under which a crystal may be 'unable to Auto-Z'.
Principles of control loop theory, including PID models and Auto-Tune for process optimization.
Represents the content of the IC6's material library, listed alphabetically by chemical formula.
To Next Page
