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| Brand | Inficon |
|---|---|
| Model | XTC/3 |
| Category | Controller |
| Language | English |
Introduces the XTC/3 controller, its versions, and basic operation principles.
Lists related manuals for sensors and accessories.
Covers safety definitions, general information, and specific warnings related to electrical hazards.
Provides instructions and requirements for returning sensor components to INFICON for service.
Details the measurement specifications, including frequency range, resolution, accuracy, and technique.
Describes the navigation structure and the dedicated screens for monitoring and programming parameters.
Outlines the storage capacity for process and film programs for XTC/3M and XTC/3S.
Lists and defines parameters for Pre/Post Deposit and Deposit stages, including ramps, levels, times, and rates.
Specifies the display type, format, resolution, and ranges for thickness and rate.
Details the quantity, configuration, function ranges, and resolution of source and recorder outputs.
Describes the ratings and types of relays and inputs available on the controller.
Lists communication interfaces like RS232 and Ethernet TCP/IP with their configurations.
Lists available accessories such as handheld controllers, kits, and software.
Specifies power requirements, apparent power, fuse rating, and temporary overvoltages.
Defines usage, temperature, humidity, altitude, installation, measurement, and pollution degree specifications.
Specifies the acceptable temperature range for storing the unit.
States that no warm-up is required but recommends a period for maximum stability.
Provides the physical dimensions of the unit.
Specifies the required clearance around front and rear connectors.
States the weight of the unit with all options.
Provides instructions for cleaning the unit using mild cleaners.
Lists available base configurations for XTC/3M and XTC/3S control units, including part numbers.
Lists the available base configurations for XTC/3M and XTC/3S control units, including part numbers.
Lists various oscillator kits, sensor emulator kits, and software accessories with their part numbers.
Lists part numbers for replacement cables and oscillators for interfacing with the controller.
Lists INFICON sensor types compatible with the XTC/3 controller.
Provides recommendations for installing the XTC/3 for optimal performance and longevity.
Discusses sensor types dictated by process needs and general guidelines from INFICON.
Illustrates and guides typical installation of INFICON water-cooled crystal sensors in vacuum chambers.
Describes rack mounting and table-top installation options for the controller.
Emphasizes electrical guidelines to prevent noise issues and ensure safe operation.
Recommends procedures for establishing a proper earth ground connection.
Details the two earth connections required for the controller and associated warnings.
Provides guidelines for routing cables to minimize noise pickup and ensure proper shielding.
Outlines the process of connecting the controller to power and signal interfaces.
Details warnings and requirements for verifying the correct input voltage before connecting power.
Advises on routing oscillator cables to avoid electromagnetic interference.
Notes the need to fabricate interface cables and refers to noise minimization guidelines.
Describes the BNC connectors for source control voltage and the use of coaxial cables.
Provides caution regarding voltage and current ratings for I/O connectors and relays.
Details the pin assignments and functions for the system I/O connector, including tables for standard and film select options.
Lists the pin assignments and functions for the auxiliary I/O connector, detailing relays and TTL outputs.
Explains how inputs are activated and their characteristics, including activation by contact closure or TTL/CMOS logic.
Explains the use of RS-232C for remote control and monitoring, including software and cable requirements.
Discusses the optional TCP/IP interface for Ethernet communications, including cable type and addressing.
Identifies and describes the functions of the front panel components, including system switches, LCD screen, data entry keys, and cursor keys.
Identifies and describes the interfaces located on the rear panel of the XTC/3 controller.
Lists the seven display screens used for monitoring and programming processes and explains display dimming features.
Explains how to navigate through the XTC/3 screens using the MENU key and cursor keys.
Describes the Operate screen, which displays active film and process information upon power-up.
Provides a detailed breakdown of the information displayed on the Operate screen, referencing figures.
Explains how crystal life is displayed and its use as an indicator for crystal replacement.
Provides recommendations for selecting gold or silver crystals based on application needs.
Explains the auto-zero function for crystal life percentage and its implications.
Shows the film parameters and values, and how to access Pre/Post Deposit, Deposit, Sensor, Source, and Option screens.
Describes the Process screen for XTC/3M, which lists programmed processes and layers, and how to navigate and delete films.
Details the General parameter screen, subdivided into Process, Hardware, and Communication Info screens.
Explains the I/O Map screen, showing programmable I/O functions or fixed I/O.
Describes the Diagnostics display, which shows firmware version, serial numbers, and allows testing of interfaces and components.
Shows typical sensor information, including active sensor, frequency, type, and crystal life, and options for switching crystals.
Explains how to start, stop, and reset a process, and suggests using TEST mode for verification.
Defines pre-deposit states like READY and CRUCIBLE SWITCH, along with their conditions and relay contact status.
Explains how unusual situations are detected as ALARMS or STOPS, and the difference between them.
Lists conditions considered ALARMS by XTC/3, which result in ALARM relay closure.
Lists actions or conditions that produce a STOP state, indicated by STOP message and relay closure.
Describes how to complete an interrupted process from a STOP state without reprogramming.
Explains features like Autostart Next Layer, Ion Assisted Deposition, Control Delay, and Shutter Delay.
Explains three methods to automate process execution, including Autostart Next Layer and remote controls.
Explains how the Ion Assist Output is activated when the film is in Deposit and the parameter is set to Yes.
Describes how Control Delay suspends the control loop to prevent response to temporary rate spikes.
Explains how Shutter Delay ensures no material deposition until rate requirements are met.
Explains how to implement film termination using a rate ramp, and notes its exclusion in Time-Power state.
Describes the Transfer Sensor function for rate control in Shutter Delay before Deposit.
Explains how crucible position output lines control evaporation sources and the Crucible Valid input.
Describes Bin mode for sequential outputs, labeled Cruc Src 1 Bin and Cruc Src 2 Bin.
Describes BCD mode using sequential outputs for crucible selection, configured via I/O Map.
Details the choices of sensor types offering backup crystals and the requirements for CrystalTwo and Dual Head sensors.
Explains the CrystalTwo option requirements, wiring, and behavior during deposition and after layer completion.
Describes how XTC/3 identifies and tracks CrystalSix positions and its automatic switching behavior during deposition.
Explains the Crystal12 sensor behavior on power-up, its verification process, and handling of Carousel Open and Xtal Fail messages.
Details how Rotary sensor type enables sequential switching for six positions and the fallback states if a good resonant frequency is not found.
Explains the Dual Head configuration, wiring, power-up initialization, and limitations like RateWatcher disablement.
Describes how Sensor Shutter outputs function as CrystalSwitch outputs in XTC/3S depending on Sensor Type.
Explains the "Start Without Backup" option for multi-position sensors and its implications for layer startup.
Explains how the RateWatcher feature automatically samples deposition rate and maintains source power for stable deposition.
Describes the optional wired Hand-held Controller for manual control of power, crystal switching, and STOP commands.
Explains how to set, clear, or recover a Lock Code to prevent unauthorized parameter changes.
Describes how to clear user-programmed parameters to default values using the CLEAR key on power-up.
Explains how the RS-232 port functions as a "send only" port for datalog output, detailing the data stream format.
States that the optional TCP/IP interface provides commands via static IP address and does not support DHCP.
Outlines the basic procedure for programming the XTC/3, including making sure it's in READY state and defining films and processes.
Explains how to access the film setup screens after pressing the MENU key.
Details accessing the Film Parameter display and navigating through Pre/Post, Deposit, Sensor, Source, and Option screens.
Defines a film by parameters like sensor/source numbers, rates, thickness, and material properties, noting differences between XTC/3M and XTC/3S.
States that film parameters are entered in the Pre/Post, Deposit, Sensor, Source, and Option screens.
Lists and defines parameters for Pre/Post Deposition, including Rise Time, Soak Power, and Soak Time for both stages.
Details deposit parameters like Rate, Final Thickness, Thickness Set Point, New Rate, and Rate Ramp Time.
Defines sensor parameters like Sensor #, Tooling, and Second Tooling, and their applicability.
Defines source parameters such as Source number, Crucible selection, Control Gain, Time Constant, Dead Time, Maximum Power, Density, and Z-Ratio.
Lists and defines optional film parameters like Time Power, Delay Option, Transfer Sensor, Transfer Tooling, Control Delay Time, Ion Assist Deposit, and Name.
Explains how to access the Process display in XTC/3M for programming processes and layers.
Details the Process screen for defining processes, including Process Number and Process Name.
Explains how to access the General Parameter display, which is subdivided into Process, Hardware, and Comm Info screens.
Details the Process parameters for XTC/3M and XTC/3S, including Process to Run and Film to Run options.
Covers hardware parameters such as Sensor Type, Source Control Voltage, Recorder Mode, Filter, Audio Feedback, and LCD Dimmer Time.
Explains the Film Select option for XTC/3S, allowing film selection based on inputs and reassigning Input #4 for RESET.
Details the Comm Info screen for configuring RS-232 and TCP/IP interfaces, including baud rate, protocol, and IP address.
Specifies RS-232 settings (Baud Rate, Protocol) and Ethernet Interface settings (IP Address, Net Mask).
Explains how to access the I/O Map display to view programmable I/O functions or fixed I/O.
Describes the fixed I/O displayed on the XTC/3S I/O Map screen and refers to Film Select Option and previous sections for details.
Explains the screen for modifying the 9 inputs in XTC/3M and how to assign input functions.
Describes how to modify relay and TTL outputs in XTC/3M, including assigning functions and setting states.
Explains how to clear input or output assignments by selecting <Blank> and entering the number.
Explains that XTC/3 can be remotely controlled, programmed, or interrogated using a remote command set.
Describes the message protocol structure, including supported RS-232 protocols and the absence of hardware handshaking.
Describes the two types of data communications hardware ports available: RS-232C and optional TCP/IP.
Details the RS-232C serial port, including connector type, cable length, configuration, and limitations.
Explains TCP/IP communication, port number, binary commands, and addressing support.
Specifies the use of a standard straight Ethernet cable for network or hub connections.
Provides manual configuration steps for PC's IP address and subnet mask for direct communication with XTC/3.
Defines the message format used for Standard and TCP/IP protocols, including mnemonics.
Defines the key elements and structure of the standard protocol, including length, message, and command formats.
Details the format of standard command packets sent from a host to the XTC/3, including length, message structure, and command groups.
Details the format of standard response packets sent from the XTC/3 to a host, including length, CCB, timer, and response message structure.
Lists general definitions and specific communication commands like ECHO, HELLO, QUERY, UPDATE, STATUS, and REMOTE.
Defines the ECHO command for echoing messages back to the sender.
Defines the HELLO command to retrieve model and software version information.
Introduces standard query commands used to retrieve parameter information.
Defines the Query Block command (QB) for retrieving all parameters or specific subsets.
Defines the command to query film names from the XTC/3M.
Defines the command to query film parameters, specifying Command ID and Film Number.
Defines the command to query general parameters, specifying Command ID.
Defines the command to query input definitions for XTC/3M, specifying Input Number.
Defines the command to query output definitions for XTC/3M, specifying Output Number.
Defines the command to query output type definitions for XTC/3M, specifying Output Number and Type.
Defines the command to query process parameters for XTC/3M, specifying Command ID, Process Number, and Parameter List.
Introduces standard commands for updating parameters.
Defines the Update Block command for updating multiple parameters in a block.
Defines the command to update film names for XTC/3M, specifying Film Number and Name.
Defines the command to update film parameters, specifying Command ID, Film Number, and Parameter Value.
Defines the command to update general parameters, specifying Command ID and Parameter Value.
Defines the command to update input definitions for XTC/3M, specifying Input Number and Definition.
Defines the command to update output definitions for XTC/3M, specifying Output Number and Definition.
Defines the command to update output type definitions for XTC/3M, specifying Output Number and Type.
Defines the command to update process parameters for XTC/3M, specifying Command ID, Process Number, and Parameter List.
Introduces standard commands for querying status information.
Introduces standard remote commands for controlling the unit, specifying command ID and action values.
Describes XTC/2 protocols (ASCII-based) that are in effect when selected under RS-232 Protocol parameter.
Lists the basic commands available via computer communications for XTC/2 protocols.
Details the protocol for XTC/2 serial communication when checksum is selected.
Details the protocol for XTC/2 serial communication when no checksum is selected.
Lists error codes (A-G) and their corresponding descriptions for XTC/2.
Lists message strings for XTC/2 commands like ECHO, HELLO, and QUERY.
Defines the ECHO command format for XTC/2.
Defines the HELLO command format for XTC/2.
Defines the QUERY command format for XTC/2.
Defines the UPDATE command format for XTC/2.
Defines the STATUS command format for XTC/2, specifying status codes.
Lists XTC/2 remote commands, their codes, functions, and descriptions.
Provides sample host programs for XTC/2 communication.
Presents a sample GWBASIC program for XTC/2 communication without checksum.
Presents a sample GWBASIC program for XTC/2 communication with checksum.
Lists and explains status and error messages encountered during operation, categorized by type.
Explains the initial diagnostics display showing firmware revision and serial numbers, and how to access test functions.
Describes how to verify output operation by toggling active outputs.
Details how to initiate the XIU Self Test to check Crystal Interface Unit and related components.
Explains how to initiate the RS-232C COMM PORT self-test using a Loop Back connector.
Introduces a guide to help diagnose and resolve issues with XTC/3 performance or operation.
Provides a symptom/cause/remedy chart for common XTC/3 issues like power, locking up, parameter loss, and key failures.
Discusses diagnosing sensor head problems using a DVM and the optional Crystal Sensor Emulator.
Explains how to check active sensor function using the Sensor Information screen.
Describes how to exercise the shutter on Crystal Two or shuttered sensors using the Diagnostics screen.
Addresses troubleshooting computer communication issues, including cable connections, baud rates, and protocols.
Explains the meaning of the LED indicators on the TCP/IP module for diagnosing network status and diagnostics.
Provides general cautions and a procedure for replacing crystals, noting exceptions for specific sensor types.
Details the step-by-step procedure for replacing the crystal in Front Load Single sensors.
States no difference in crystal replacement between shuttered and non-shuttered sensors.
Provides a step-by-step procedure for replacing the crystal in Cool Drawer sensors.
Describes crystal replacement for Bakeable sensors, noting the cam assembly unlock procedure.
Provides instructions for replacing the crystal in a sputtering sensor, including special crystal usage.
Explains how to use the crystal snatcher for removing and reinserting the crystal retainer.
Refers to the CrystalSix Operating Manual for specific instructions.
Refers to the Crystal12 Operating Manual for specific instructions.
Introduces the Crystal Sensor Emulator for diagnosing deposition controller measurement systems.
Describes procedures using the emulator to analyze Crystal Fail messages.
Details steps to diagnose the measurement system using the emulator and BNC cable, checking for XTAL Fail messages.
Provides diagnostic steps for the feed-through and in-vacuum cable using the emulator and Ohm meter.
Details diagnostic steps for the sensor head or monitor crystal using the emulator and Ohm meter.
Outlines tasks to perform if the Crystal Fail message persists after diagnostics, including checking retainer and cover.
Explains the expected % XTAL Life display reading when using the Crystal Sensor Emulator.
Discusses the compatibility of the Crystal Sensor Emulator's Sensor Cover Connector with different sensor heads.
Lists sensor heads compatible with the Crystal Sensor Emulator's Sensor Cover Connection.
Lists sensor heads incompatible with the Crystal Sensor Emulator's Sensor Cover Connector.
Lists the dimensions, temperature range, frequency, and materials of the Crystal Sensor Emulator.
Explains the importance of density, tooling, and Z-Ratio for accurate thickness measurement and calibration.
Provides steps to determine density value using a substrate and short deposition, referencing material library values.
Outlines steps to calculate the tooling factor using a test substrate, deposition, and a specific relationship.
Explains how to calculate Z-Ratio from material properties and describes a direct method for precise calibration.
Provides rules for estimating Z-Ratio for multiple layer depositions based on relative layer thicknesses.
Explains the fundamental principles of quartz crystal microbalance (QCM) and its use in vacuum deposition.
Describes the quartz resonator, its frequency response spectrum, and improvements in monitor crystal design.
Explains the period measurement technique using a second oscillator to determine crystal oscillation period.
Describes the Z-Match equation developed by Lu and Lewis for real-time calculation of thickness.
Explains the active oscillator circuit used to keep the crystal in resonance and its stability characteristics.
Introduces INFICON's ModeLock Oscillator technology for eliminating oscillator limitations and improving accuracy.
Explains the instrumental advances in measurement and their translation into process control using PID models and tuning techniques.