Installing and connecting the device
3.3 Connecting the device
SIMATIC IPC647D
Operating Instructions, 01/2014, A5E32996306-AA
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Fault caused by I/O devices
The connection of I/O devices can cause faults in the device. The result may be personal
injury and damage to the machine or plant. Note the following:
• Connect only I/O devices which are approved for industrial applications in accordance
with EN 61000-6-2/IEC 61000-6-2.
• I/O devices that do not support hot-plugging may not be connected until the device is
powered off.
Damage through regenerative feedback
Regenerative feedback of voltage to ground by a connected or installed component can
damage the device.
Connected or built-in I/Os, for example, a USB drive, are not permitted to supply any
voltage to the device. Regenerative feedback is generally not permitted.
Connection of equipotential bonding
A low-resistance ground connection ensures that interference signals generated by external
power supply cables, signal cables or cables to the I/O modules are safely discharged to
ground.
The equipotential bonding connection of the device is located on the side of the device and
is identified by the following symbol:
● TORX T20 screwdriver
● An equipotential bonding cable with a minimum cross-section of 2.5 mm
2
Connecting the equipotential bonding connection
device with the equipotential bonding cable. Ensure that
the equipotential bonding cable has a large-area contact
with the housing.
Connect the equipotential bonding cable with the central
grounding point of the cabinet in which the device is
installed. Ensure that the equipotential bonding cable has
a large-area contact with the central grounding point.
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