238 1260 Infinity Binary Pump User Manual
13 Hardware Information
Instrument Layout
Instrument Layout
The industrial design of the module incorporates several innovative
features. It uses Agilent’s E- PAC concept for the packaging of electronics
and mechanical assemblies. This concept is based upon the use of
expanded polypropylene (EPP) layers of foam plastic spacers in which the
mechanical and electronic boards components of the module are placed.
This pack is then housed in a metal inner cabinet which is enclosed by a
plastic external cabinet. The advantages of this packaging technology are:
• virtual elimination of fixing screws, bolts or ties, reducing the number
of components and increasing the speed of assembly/disassembly,
• the plastic layers have air channels molded into them so that cooling
air can be guided exactly to the required locations,
• the plastic layers help cushion the electronic and mechanical parts from
physical shock, and
• the metal inner cabinet shields the internal electronics from
electromagnetic interference and also helps to reduce or eliminate radio
frequency emissions from the instrument itself.
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