System Overview 2-9
Figure 2-14: Step Height Standard
• A variety of styli for measuring fine surface features and softer samples.
• Stress Measurement for calculating tensile or comprehensive stress on processed wafers.
• The 3D Mapping Option that enables true 3D-mapping (see Figure 2-15), calculates the bearing
ratio, and performs many other analyses.
• 200-mm (7.8 inch) data-stitching software for increasing the scan length to 150 mm or longer
with multiple stitching operations (available only on systems that include the X-Y auto stage).
Figure 2-15: 2D Contour Plot Generated with the 3D Mapping Option
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