Table 15. The PowerEdge MX760c thermal restriction matrix (continued)
Configuration 6 x 2.5-inch BP 6 x 2.5-inch BP 4 x 2.5-inch BP 8 x E3.s BP Diskless in 4 x
2.5" BP
Adjacent Sled Condition
Support
Not Limited Optimized* Not Limited Not Limited Not Limited
Front Storage Type SAS
drive
NVMe
drive
SAS
drive
NVMe
drive
SAS
drive
NVMe
drive
E3 drive No drive
6458Q 350W Not Supported Not Supported Liquid Cooling
Required
Liquid Cooling
Required
Liquid Cooling
Required
Mem
ory
(Syst
em Is
Air
Cool
ed,
No
Liqui
d)
256 GB
RDIMM
4800
13.2W,
2 DPC
30°C 30°C 30°C 30°C 35°C 35°C 35°C 35°C 35°C 35°C
128 GB
RDIMM
4800
9.7W,
2 DPC
35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C 35°C
64 GB
RDIMM
4800
8.5W,
2 DPC
45°C 45°C 45°C 45°C 45°C 45°C 45°C 45°C 45°C 45°C
32 GB
RDIMM
4800
4.2W,
2 DPC
45°C 45°C 45°C 45°C 45°C 45°C 45°C 45°C 45°C 45°C
PCI
Card
Mezzanine card,
Tier2, ≤ 30 W
45°C 45°C 45°C 45°C 45°C 45°C 45°C 45°C 45°C 45°C
Mini Mezzanine
card
45°C 45°C 45°C 45°C 45°C 45°C 45°C 45°C 45°C 45°C
Note
s
* Optimized sled condition is to recommend the nearby sleds population with same storage configuration or sled blank
for thermally optimization by air cooling.
** Wider HPR heatsink is required for > 225W CPUs
*** Max DIMM count support for wider HPR heatsink is 24 pcs depended on DIMM population guidance.
**** Liquid cooling solution can support all CPU SKUs, but is limited in 4 drives BP and E3.s BP configurations due to
ME constrain
Extended ambient restrictions
ASHRAE A3 environment
●
Do not perform a cold startup below 5°C
● The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
● With Air Cooling Solution, Higher wattage processors, Thermal Design Power (TDP) > 185 W are not supported.
● With Liquid Cooling Solution, all processors are supported.
● Non-Dell qualified peripheral cards or peripheral cards greater than 30 W are not supported.
● PCIe SSD is not supported.
● 128 GB or higher capacity RDIMM is not supported.
● E3.s drive is not supported.
ASHRAE A4 environment
● Do not perform a cold startup below 5°C.
● The operating temperature specified is for a maximum altitude of 3050 m (10,000 ft).
● With Air Cooling Solution, Higher wattage processors, Thermal Design Power (TDP) > 165 W are not supported.
● With Liquid Cooling Solution, all processors are supported.
24
Technical specifications
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