Dell PowerEdge R960 - Thermal Restriction Matrix

Table 25. Particulate contamination specifications (continued)
Particulate contamination Specifications
NOTE: This condition applies to data center environments only. Air
filtration requirements do not apply to IT equipment designed to be
used outside a data center, in environments such as an office or
factory floor.
NOTE: Air entering the data center must have MERV11 or MERV13
filtration.
Conductive dust Air must be free of conductive dust, zinc whiskers, or other
conductive particles
NOTE: This condition applies to data center and non-data center
environments.
Corrosive dust
● Air must be free of corrosive dust
● Residual dust present in the air must have a deliquescent point less
than 60% relative humidity
NOTE: This condition applies to data center and non-data center
environments.
Walk-Up Edge Data Center or Cabinet (sealed, closed
loop environment)
Filtration is not required for cabinets that are anticipated to be opened
6 times or less per year. Class 8 per ISO 1466-1 filtration as defined
above is required otherwise
NOTE: In environments commonly above ISA-71 Class G1 or that
may have known challenges, special filters may be required.
Table 26. Gaseous contamination specifications
Gaseous contamination Specifications
Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/ISA71.04-2013
Silver coupon corrosion rate <200 Å/month as defined by ANSI/ISA71.04-2013
Thermal restriction matrix
Table 27. Processor and heat sink matrix
Heat sink Processor TDP
STD HSK ≤ 185 W
L-type HSK ≥ 195 W
Table 28. Label reference
Label Description
STD Standard fan
HSK Heat sink
LP Low Profile
FH Full Height
NOTE: The ambient temperature of the configuration is determined by the critical component in that configuration. For
example, if the processor's supported ambient temperature is 35°C (95°F), the DIMM is 35°C (95°F), and the GPU is
30°C (86°F), the combined configuration can only support 30°C (86°F).
34 Technical specifications