Figure 539. Removing the system processor module tool
f) Lift the tool off the system processor module.
g) Inspect the thermal interface material (TIM) for visible signs of damage, as shown in the following
îš³gure.
• The thermal interface material (TIM) is typically adhered to the heat sink.
• Unless damaged, the TIM that is adhered to the heat sink can be reused.
• The previous TIM needs to be perfectly flat to be reused.
• If the TIM is damaged, torn, wrinkled, or if you are unsure, do not reuse the removed heat sink.
• Ensure that you have a spare TIM and heat sink on hand.
System backplanes
617
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