3. Insert the drive backplate tabs into the slots on the bottom of the backplate
cage and push down the retention latch on top of the drive cage; then, rotate
the drive backplate assembly forward until the backplate is latched.
4. Reinstall the drive and filler panel and plastic drive-bay spacer.
5. Install the cover (see Replacing the server top cover).
6. Reconnect the power cords and any cables that you removed.
7. Turn on the peripheral devices and the server.
Removing and replacing Tier 2 CRUs
You may install a Tier 2 CRU yourself or request IBM to install it, at no additional
charge, under the type of warranty service that is designated for your server.
The illustrations in this document might differ slightly from your hardware.
Removing a microprocessor and heat sink
Attention:
v Be extremely careful, the pins on the socket are fragile. Any damage to the pins
may require replacing the system board.
v Do not allow the thermal grease on the microprocessor and heat sink to come in
contact with anything.
v Removing the heat sink from the microprocessor destroys the even distribution
of the thermal grease and requires replacing the thermal grease.
v Do not touch the microprocessor contacts; handle the microprocessor by the
edges only. Contaminants on the microprocessor contacts, such as oil from your
skin, can cause connection failures between the contacts and the socket.
v Use the microprocessor installation tool that came with the new microprocessor
to remove and install the microprocessor. Failure to use the microprocessor tool
may cause damage to the pins on the socket. Any damage to the pins may
require replacing the system board.
To remove a microprocessor and heat sink, complete the following steps:
1. Read the safety information that begins on page Safety and “Installation
guidelines” on page 30.
2. Turn off the server (see “Turning off the server” on page 21) and all attached
peripheral devices. Disconnect all power cords; then, disconnect all external
cables as necessary to replace the device.
3. Remove the server cover (see “Removing the server top cover” on page 362).
4. Disconnect any cables that impede access to the heat sink and microprocessor.
5. Remove the air baffle (see “Removing the air baffle” on page 365).
6. If you are removing microprocessor 1, remove the memory module from
DIMM connector 5. If you are removing microprocessor 2, remove the
memory module from DIMM connector 12. See “Removing a memory
module” on page 312 for instructions.
7. Loosen the screws on the heat sink with a screwdriver, alternating among the
screws until they are loose. If possible, each screw should be rotated two full
rotations at a time.
8. Gently pull the heat sink off the microprocessor. Lift the heat sink out of the
server. If the heat sink sticks to the microprocessor, slightly twist the heat sink
back and forth to break the seal. After removal, place the heat sink on its side
on a clean, flat surface.
Chapter 6. Removing and replacing components 347
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