IBM x3100 M5 Type 5457 User Manual

7. Install the heat sink:
Attention: Do not touch the thermal material on the bottom of the heat sink.
Touching the thermal material will contaminate it. If the thermal material on
the microprocessor or heat sink becomes contaminated, contact your service
technician.
a. Align the screw holes on the heat sink with the holes on the system board.
b. Tighten the screws with a screwdriver, alternating among the screws until
they are tight. If possible, each screw should be rotated two full rotations
at a time. Repeat until the screws are tight. Do not overtighten the screws
by using excessive force.
Microprocessor
Alignment
marks
Microprocessor
bracket frame
Microprocessor
release lever
System board
Figure 223. Microprocessor socket levers and retainer engagement for 4U server model with
non-hot-swap power supplies
Chapter 6. Removing and replacing components 305

IBM x3100 M5 Type 5457 Specifications

General

Memory	Up to 32 GB
Form Factor	Tower
Chipset	Intel C222
Processor	Intel Xeon E3-1200 v3 series, Intel Core i3 series, Intel Pentium series
Memory Type	DDR3 ECC
Memory Slots	4 DIMM slots
RAID Support	RAID 0, 1, 10
Network	Dual Gigabit Ethernet
Storage Bays	4 x 3.5-inch
Operating System Support	Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware
Expansion Slots	1 PCIe 3.0 x8