Intel S2600WF - Figure 18. Intel OP HFI Connector Location; Figure 19. Multi-Chip Package (MCP)

Intel® Server Board S2600WF Product Family Technical Product Specification
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Figure 18. Intel® OP HFI connector location
Fabric processor support is a multi-chip package (MCP) option, where the processor Intel OP HFI connector
is cabled to an IFT carrier board installed into in any available PCIe* add-in card slot or within the OCP
module bay. A second cable carrying Intel Omni-Path side band signals is connected between the IFT carrier
board and sideband connectors on the server board. External cables attach the IFT carrier board to an
external Intel Omni-Path Switch.
Figure 19. Multi-chip package (MCP)
The following figure illustrates two supported dual processor configurations with one or two fabric
processors. In the diagram, each processor HFI connector is cabled to a QSFP28 interface card
1 port x 100 Gbps
Intel® OP HFI Connector