Intel® Server Board S2600WF Product Family Technical Product Specification
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Figure 23. IFT carrier board – rear view
Table 6. IFT carrier LED functionality
Link established but not activated by management
Link activated by management; but no traffic is present
For external connection, the IFT carrier includes two QSFP+28 style connectors. The signal definition of
these connectors consists of the high speed diff pairs, miscellaneous sideband signals, and 3.3 V power. The
3.3 V power is used for the active logic within the QSFP+ modules. As noted in Table 7, QSFP+ modules have
four power classes that control how much power the active logic in the cable can consume.
Table 7. Power level classification for QSFP+ modules
Power Level Class Max Power (W)
1 1.5
2 2.0
3 2.5
4 3.5
The server board has support for processor configurations where one or two installed processors may have
an Intel OP HFI. In dual processor configurations, with at least one processor having support for Intel OP HFI,
the following population rules apply:
• The base SKU number of both processor types must be the same.
o Example: Intel® Xeon® Platinum 8160F (Intel OP HFI) + Intel Xeon Platinum 8160 (non-fabric)
o Example: Intel Xeon Gold 6140F (Intel OP HFI) + Intel Xeon Gold 6140F (Intel OP HFI)
There is no restriction on which processor socket is populated with the fabric processor and which processor
socket is populated with the matching non-fabric processor.
Table 8. Supported processor mixing – fabric vs non-fabric processors
CPU Socket 1 CPU Socket 2 Platform Expected Behavior
Processor Processor Boot to OS
Processor Fabric Processor Boot to OS
Fabric Processor Processor Boot to OS
Fabric Processor Fabric Processor Boot to OS
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