Motorola MXP600 - Performing Back Chassis Sub-Assembly Troubleshooting; Performing Bottom Connector Sub-Assembly Troubleshooting

Procedure:
1 Prepare a golden sample for troubleshooting reference.
IMPORTANT: Golden sample kit must pass the vacuum leak test.
2 Troubleshoot the faulty radio starting from the steps at Performing Back Chassis Sub-Assembly
Troubleshooting.
8.2.1
Performing Back Chassis Sub-Assembly Troubleshooting
Procedure:
1 Replace the back chassis sub-assembly.
2 Watch for pinching of main O-ring, battery connector seal and SIM card door seal during
assembly.
3 Perform leak test following the steps from Performing Vacuum Leak Test.
4 Perform one of the following actions:
If… Then…
Pass Troubleshooting ends here.
Fail Continue to the next step.
5 Re-assemble back chassis sub-assembly onto the golden sample kit and perform vacuum leak
test.
6 Perform one of the following actions:
If… Then…
Pass Back chassis sub-assembly can be re-used.
Fail Scrap the back chassis sub-assembly.
7 Proceed with Performing Bottom Connector Sub-Assembly Troubleshooting.
8.2.2
Performing Bottom Connector Sub-Assembly Troubleshooting
Procedure:
1 Replace the bottom connector sub-assembly.
2 Watch for pinching of bottom connector O-ring.
3 Perform leak test following the steps from Performing Vacuum Leak Test.
4 Perform one of the following actions:
If… Then…
Pass Troubleshooting ends here.
Fail Continue to the next step.
5 Re-assemble bottom connector sub-assembly onto the golden sample kit and perform vacuum
leak test.
MN006362A01-AL
Chapter 8 : Radio Leak Test
165