Table 2-16. GPIO mapping
LX2160A pin LX2160A GPIO function LX2160A primary function
IRQ0 GPIO3[0] IRQ_40GE_B
IRQ1 GPIO3[1] PHY_25G_LOL
IRQ2 GPIO3[2] IRQ_10G_PHY1_B
IRQ3 GPIO3[3] IRQ_10G_PHY2_B
IRQ4 GPIO3[4] IRQ_EPHY1_B
IRQ5 GPIO3[5] IRQ_EPHY2_B
IRQ6 GPIO3[6]
IRQ7 GPIO3[7] IRQ_FAN_B
IRQ8 GPIO3[8] IRQ_RTC_B
IRQ9 GPIO3[9] PHY_25G_LOL (if SFP2_MOD_ABS is low)
IRQ10 GPIO3[10] PHY_25G_LOL (if SFP3_MOD_ABS is low)
IRQ11 GPIO3[11] IRQ_QSFP_B
EVT0_B GPIO3[12]
EVT1_B GPIO3[13]
EVT2_B GPIO3[14]
EVT3_B GPIO3[15]
EVT4_B GPIO3[16]
NOTE
Because all IRQ signals have a pull-up, GPIO pins programmed
to input mode default to “1”.
2.16 Temperature measurement
The LX2160A processor has two thermal monitoring diodes, which can be measured on
the LX2160ARDB by two thermal monitor devices, SA56004ED and SA56004FD, from
NXP. Software can perform direct die temperature readings with an accuracy of ±1 °C.
See I2C interface for addressing information.
In addition to monitoring, the SA56004ED and SA56004FD devices can also trigger
alarms upon detecting thermal problems. To do this, the thermal warning and thermal
alert signals from these devices are connected to the system controller (CPLD), as well as
to status LEDs. The CPLD uses these signals to power down the system, to protect the
processor from over-temperature damage.
The LX2160ARDB thermal management scheme is shown in the figure below.
Chapter 2 LX2160ARDB Functional Description
QorIQ LX2160A Reference Design Board Reference Manual, Rev. 0, 09/2018
NXP Semiconductors 51
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