Technical specifications
8.4 Technical data
SIMATIC IPC847D
124 Operating Instructions, 01/2014, A5E32997454-AA
Resistance to shock
- Operation
1, 2
Tested to IEC 60068-2-27, IEC 60068-2-29
Half-sine: 50 m/s
2
, 30 ms, 100 shocks per axis
2
, 6 ms, 1000 shocks per axis
Chipset Intel® DH82C226 Express Chipset
(Platform Controller Hub)
Integrated RAID (on-board)
Mobile Intel® 8 Series SATA RAID Controller
Processor
• Intel® Xeon™ E3-1268L v3 2.3 (3.3) GHz, 4 cores, GT2,
8 MB SLC, HT
• Intel® Core™ i5-4570TE 2.7 (3.3) GHz, 2 cores, GT2, 4
MB SLC, AMT
• Intel® Core™ i3-4330TE 2.4 GHz, 2 cores, GT2, 3 MB
SLC, AMT
RAM 4 DIMM socket maximum 32 GB DDR3 with 1600MT/s
SDRAM
Modules with and without ECC can be operated.
Memory expansion 2 GB to 32 GB DDR3, max. 3.5 GB can be used for 32-bit
operating system and applications.
Modules with and without ECC can be ordered
(configuration see ordering documentation). Module size
maximum 8 GB, module organization 2 GBit / 4 GBit based
x8 organized
Expansion slots Two versions of the bus board can be ordered in the
Configurator:
• Variant 1, 11 slots: 7 × PCI, 3 × PCIe x4 (PCIe x1 Lane
Gen2), 1 × PCIe x16 Gen3
• Variant 2, 11 slots: 3 × PCI, 5 × PCIe x16 (2 × PCIe x4
Lane Gen2, 2 × PCIe x4 Lane Gen3, 1 × PCIe x8 Gen3),
3 × PCIe x4 Gen2
Max. permissible power consumption
5 V/5 A or 3.3 V/7 A, 12 V/0.5 A, -12 V/0.05, 3.3 Vaux/0.4 A
Max. permitted power consumption per
PCIe slot 1, 2, 3
PCIe x4 expansion card: 3.3 V/3A; 12 V/2.1 A,
Max. permitted power consumption per
PCIe x16 expansion card: 3.3 V/3A; 12 V/2.1 A,
Max. permissible power loss per PCI
Accumulated power loss (all voltages) may not exceed 25W.
Maximum bandwidth of PCI slots
Maximum bandwidth of PCIe slots Gen 2, 5 GT/s (500 MB/s) bandwidth per lane
Gen 3, 8 GT/s (985MB/s) bandwidth per lane
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