ST STEVAL-WBC86TX - Page 77

Figure 54. Reading from multiple registers........................................................ 41
Figure 55. Interrupt registers ................................................................. 42
Figure 56. FHOP settings ...................................................................43
Figure 57. FHOP example...................................................................43
Figure 58. PID parameters .................................................................. 44
Figure 59. Power up waveform ............................................................... 46
Figure 60. X, Y axis for misalignment ........................................................... 47
Figure 61. Efficiency curve in X axis ............................................................ 48
Figure 62. Efficiency curve in Y axis ............................................................48
Figure 63. Efficiency curve in Z axis ............................................................ 49
Figure 64. Thermal performance .............................................................. 49
Figure 65. Ring node voltage sensing ........................................................... 51
Figure 66. Ring node divider configuration........................................................ 51
Figure 67. Pin connection between host and STWBC86 chip/evaluation board...............................52
Figure 68. Connectivity .....................................................................53
Figure 69. STEVAL-WBC86TX circuit schematic (1 of 4) .............................................. 55
Figure 70. STEVAL-WBC86TX circuit schematic (2 of 4) .............................................. 56
Figure 71. STEVAL-WBC86TX circuit schematic (3 of 4) ..............................................57
Figure 72. STEVAL-WBC86TX circuit schematic (4 of 4) ..............................................58
Figure 73. Top layer .......................................................................62
Figure 74. Inner1 layer ..................................................................... 63
Figure 75. Inner2 layer ..................................................................... 64
Figure 76. Bottom layer..................................................................... 65
Figure 77. Temperature Before Power Transfer Maximum 25⁰C on STEVAL-WBC86TX ........................ 68
Figure 78. Maximum Temperature of the Board after 2hours (40.8⁰C) - 5W power transfer STEVAL-WLC38RX ........ 69
Figure 79. Maximum Temperature of the Board and Plastic case after 2hours (33.5⁰C) - 5W power transfer........... 70
UM3161
List of figures
UM3161 - Rev 1
page 77/78