Triconex Trident - Interconnect Assemblies

Interconnect Assemblies 121
Chapter 3 System Description
Interconnect Assemblies
Two interconnect assemblies are available:
MP Interconnect Assembly
An MP Interconnect Assembly carries the I⁄O, communication, and system power
buses between baseplates. Physically, an MP Interconnect Assembly consists of a
small passive PCB in a molded plastic housing with two DIN-C 96-pin male
connectors and mounts to the top or bottom of MP Baseplates to bridge adjacent
baseplates.
Each MP Baseplate includes one MP Interconnect Assembly.
I⁄O Interconnect Assembly
An I⁄O Interconnect Assembly carries the TMR I⁄O and system power buses
between baseplates. An I⁄O Interconnect Assembly consists of a small passive PCB
in a molded plastic housing with two DIN-C 96-pin male connectors and mounts
to the top or bottom of I⁄O baseplates or Extender Assemblies to bridge adjacent
baseplates.
Each I⁄O baseplate includes one I⁄O Interconnect Assembly.
Model Description
2920 MP Interconnect Assembly
2921 I⁄O Interconnect Assembly
Interconnect
Assemblies
MP Interconnect Assembly
I⁄O Interconnect Assembly