Triconex Trident - Model 2301 Digital Input Baseplate

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Input/Output Modules 83

Chapter 3 System Description

Model 2301 Digital Input Baseplate

The following table lists the short circuit current specifications for field short-to-

ground faults.

Feature Specification

Fault current 130 mA, typical

200 mA, maximum

Main Page

Default Chapter3
- Table of Contents3
Preface11
How this Guide Is Organized12
Related Documents13
How to Contact Triconex13
Requesting Technical Support13
- Gathering Supporting Documentation14
- Contacting Triconex Technical Support14
Training15
Chapter 1 Theory of Operation17
Controller Features18
Fault Tolerance19
Controller Architecture20
- Main Processor Architecture21
- Bus and Power Distribution23
- Controller Communications25
- Input/Output Modules28
- Logic Power31
- System Diagnostics and Status Indicators32
Chapter 2 International Approvals33
- Canadian Standards Association34
  - Test Report34
- Factory Mutual35
  - Test Report35
- European Union CE Mark36
- TÜV Rheinland37
  - Test Report37
- Semiconductor Equipment and Materials International (SEMI)38
  - Test Report38
  - Installation Guidelines38
Chapter 3 System Description39
- System Overview40
- Main Processor Module46
Communication Module 4157
- Communication Capabilities57
- Model 3201 Communication Module59
- Specifications60
  - Logic Power60
  - Communication Ports61
- Model 2201 Communication Module Baseplate63
Input/Output Modules65
- Field Terminations65
- Common Specifications66
- Analog Input Module68
- Analog Output Modules85
- Digital Input Module95
  - Model 3301 Digital Input Module96
  - Model 2301 Digital Input Baseplate99
- Digital Output Module102
- Pulse Input Module112
- Solid-State Relay Output Module124
  - Model 3451 Solid-State Relay Output Module125
  - Model 2451 Solid-State Relay Output Baseplate128
I⁄O Extender Modules131
- Model 2281 I⁄O Extender Module Kit132
- Model 2291 I⁄O Extender Module Kit132
- Model 2292 I⁄O Extender Module Kit132
  - Connecting I⁄O Extender Modules133
- Interconnect Assemblies137
  - MP Interconnect Assembly137
  - I⁄O Interconnect Assembly137
- End Caps138
- Covers139
Chapter 4 Installation and Maintenance141
- Guidelines142
- Installation Procedures160
Effective Grounding Methods165
- Ground Systems165
- Connecting Baseplates to Protective Earth166
- Connecting to Signal Ground168
- Connecting Shields to Earth170
Connecting to a Tristation PC172
- Connecting Tristation to an MP Port172
- Connecting Tristation to a CM Port175
Connecting to Serial Ports on the MP177
Connecting to Serial Ports on the CM178
Configuring Output Voter Diagnostics179
- Disabling OVD on DO Modules179
Controller Verification180
Performing Routine Maintenance181
- Checking System Power Sources181
- Output Voter Diagnostics (OVD)182
- Verifying Spare Modules182
Chapter 5 Fault and Alarm Indicators183
Overview184
- Fault and Alarm Indicators184
  - Identifying Fault and Alarm Conditions184
Main Processor Indicators185
- MP Status Indicators186
- MP System Mode Indicators187
- MP Alarm Indicators188
- MP Communication Indicators189
Communication Module Indicators190
- CM Status Indicators191
- CM Communication Indicators192
Analog Input Module Indicators193
- AI Status Indicators194
- AI Field Power Indicator195
Analog Output Module Indicators196
- AO Status Indicators197
- AO Field Alarm Indicator198
Digital Input Module Indicators199
- DI Status Indicators200
- DI Field Power Indicator201
- DI Point Indicators201
Digital Output Module Indicators202
- DO Status Indicators203
- DO Power/Load Indicator204
- DO Point Indicator204
Pulse Input Module Indicators205
- PI Status Indicators206
- PI Field Fault Indicator207
- PI Point Indicators207
Solid-State Relay Output Module Indicators208
- SRO Status Indicators209
- SRO Point Indicators210
Replacing Modules211
- Guidelines for Replacing Modules211
- Replacing a Main Processor Module212
- Replacing a Communication Module213
- Replacing an I⁄O Module Without a Hot Spare214
- Replacing an I⁄O Module with a Hot Spare215
Appendix A Pin-Outs for Cables and Connectors217
MP Baseplate Connectors218
- Ethernet Tristation Connector218
- Modbus RS-232/RS-485 Serial Connector218
CM Baseplate Connectors221
- Modbus RS-232/RS-485 Serial Connector221
- Ethernet 10Baset Net1 Connectors224
- Ethernet 100Basetx Net2 Connectors224
- AUI 10 Megabit Ethernet MAU Connectors225
- MII Ethernet MAU Connectors225
10Baset Network Cables for Tristation228
- 10Baset Cross-Over Cable228
- 10Baset Straight-Through Cable229
RS-232 Modbus Serial Cable230
Modbus Serial Cables231
- Cable Selection233
- Cable Termination233
Diagread Cables and Debug Connectors235
- Mps and Left-Position Cms235
- I⁄O Modules and Right-Position Cms236
Appendix B Recommended Parts for Replacement239
Appendix C Recommended Wiring Methods241
General Considerations242
Conduit Shielding243
Cable Spacing243
Tray Recommendations244
Grounding244
Non-Incendive Circuit Parameters245
Appendix D Non-Incendive Circuit Parameters247
Appendix E Upgrades and Repairs247
Appendix F Mounting Panel Drill Template249
EU Declaration of Conformity251
Appendix G EU Declaration of Conformity253
Warning Labels253
General Hazard254
Hazardous Voltage255
Hot Surface256
Appendix H Warning Labels257
Glossary257
Index265

Triconex Trident - Model 2301 Digital Input Baseplate

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